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Bibliographic details for 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)

APA style

17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 05:25, May 12, 2024 from http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851.

MLA style

"17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 06:20 UTC. 12 May 2024, 05:25 <http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851>.

MHRA style

WikiPatents contributors, '17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 06:20 UTC, <http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851> [accessed 12 May 2024]

Chicago style

WikiPatents contributors, "17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851 (accessed May 12, 2024).

CBE/CSE style

WikiPatents contributors. 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 06:20 UTC [cited 2024 May 12]. Available from: http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851.

Bluebook style

17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851 (last visited May 12, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851",
   note = "[Online; accessed 12-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851}",
   note = "[Online; accessed 12-May-2024]"
 }


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