Cite This Page

Jump to navigation Jump to search

Bibliographic details for 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

Citation styles for 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 13:29, May 12, 2024 from http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309.

MLA style

"17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 04:53 UTC. 12 May 2024, 13:29 <http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309>.

MHRA style

WikiPatents contributors, '17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 04:53 UTC, <http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309> [accessed 12 May 2024]

Chicago style

WikiPatents contributors, "17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309 (accessed May 12, 2024).

CBE/CSE style

WikiPatents contributors. 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 04:53 UTC [cited 2024 May 12]. Available from: http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309.

Bluebook style

17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309 (last visited May 12, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309",
   note = "[Online; accessed 12-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17462458._CHIP_PACKAGE_STRUCTURE_WITH_MULTIPLE_GAP-FILLING_LAYERS_AND_FABRICATING_METHOD_THEREOF_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20309}",
   note = "[Online; accessed 12-May-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"