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Bibliographic details for 17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

Citation styles for 17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 08:31, May 11, 2024 from http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321.

MLA style

"17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 04:57 UTC. 11 May 2024, 08:31 <http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321>.

MHRA style

WikiPatents contributors, '17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 04:57 UTC, <http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321> [accessed 11 May 2024]

Chicago style

WikiPatents contributors, "17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321 (accessed May 11, 2024).

CBE/CSE style

WikiPatents contributors. 17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 04:57 UTC [cited 2024 May 11]. Available from: http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321.

Bluebook style

17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321 (last visited May 11, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321",
   note = "[Online; accessed 11-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17459065. DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTURE MANUFACTURING METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17459065._DIELECTRIC_PROTECTION_LAYER_IN_MIDDLE-OF-LINE_INTERCONNECT_STRUCTURE_MANUFACTURING_METHOD_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20321}",
   note = "[Online; accessed 11-May-2024]"
 }


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