Cite This Page

Jump to navigation Jump to search

Bibliographic details for 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

Citation styles for 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

APA style

17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated). (2024, January 4). WikiPatents, . Retrieved 03:50, May 17, 2024 from http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972.

MLA style

"17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)." WikiPatents, . 4 Jan 2024, 05:03 UTC. 17 May 2024, 03:50 <http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972>.

MHRA style

WikiPatents contributors, '17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)', WikiPatents, , 4 January 2024, 05:03 UTC, <http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972> [accessed 17 May 2024]

Chicago style

WikiPatents contributors, "17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)," WikiPatents, , http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972 (accessed May 17, 2024).

CBE/CSE style

WikiPatents contributors. 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) [Internet]. WikiPatents, ; 2024 Jan 4, 05:03 UTC [cited 2024 May 17]. Available from: http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972.

Bluebook style

17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated), http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972 (last visited May 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972",
   note = "[Online; accessed 17-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17456068._INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_A_PACKAGE_SUBSTRATE_WITH_A_DOUBLE_SIDE_EMBEDDED_TRACE_SUBSTRATE_(ETS),_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=24972}",
   note = "[Online; accessed 17-May-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"