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Bibliographic details for 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

Citation styles for 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

APA style

17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated). (2024, January 2). WikiPatents, . Retrieved 03:27, May 17, 2024 from http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909.

MLA style

"17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)." WikiPatents, . 2 Jan 2024, 03:43 UTC. 17 May 2024, 03:27 <http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909>.

MHRA style

WikiPatents contributors, '17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)', WikiPatents, , 2 January 2024, 03:43 UTC, <http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909> [accessed 17 May 2024]

Chicago style

WikiPatents contributors, "17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)," WikiPatents, , http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909 (accessed May 17, 2024).

CBE/CSE style

WikiPatents contributors. 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) [Internet]. WikiPatents, ; 2024 Jan 2, 03:43 UTC [cited 2024 May 17]. Available from: http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909.

Bluebook style

17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated), http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909 (last visited May 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909",
   note = "[Online; accessed 17-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17443740._SPLIT_DIE_INTEGRATED_CIRCUIT_(IC)_PACKAGES_EMPLOYING_DIE-TO-DIE_(D2D)_CONNECTIONS_IN_DIE-SUBSTRATE_STANDOFF_CAVITY,_AND_RELATED_FABRICATION_METHODS_simplified_abstract_(QUALCOMM_Incorporated)&oldid=19909}",
   note = "[Online; accessed 17-May-2024]"
 }


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