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Bibliographic details for 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

Citation styles for 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 11:03, May 14, 2024 from http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326.

MLA style

"17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 04:59 UTC. 14 May 2024, 11:03 <http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326>.

MHRA style

WikiPatents contributors, '17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 04:59 UTC, <http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326> [accessed 14 May 2024]

Chicago style

WikiPatents contributors, "17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326 (accessed May 14, 2024).

CBE/CSE style

WikiPatents contributors. 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 04:59 UTC [cited 2024 May 14]. Available from: http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326.

Bluebook style

17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326 (last visited May 14, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326",
   note = "[Online; accessed 14-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17412641._SOLDER_RESIST_STRUCTURE_TO_MITIGATE_SOLDER_BRIDGE_RISK_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20326}",
   note = "[Online; accessed 14-May-2024]"
 }


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