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• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
  ...), [[:Category:H01L29/06|H01L29/06]] (20), [[:Category:H01L29/66795|H01L29/66795]] (20) IPC Code(s): H01L21/764, H01L29/78, H01L29/06, H01L29/66, H01L29/08
  99 KB (12,848 words) - 09:00, 30 January 2024
• Patent Applications Report for 6th Oct 2023
  ...Category:H01L23/00|H01L23/00]] (13 applications), [[:Category:H01L29/42392|H01L29/42392]] (12 applications) ...tegory:H01L29/66795|H01L29/66795]] (9 applications), [[:Category:H01L29/78|H01L29/78]] (7 applications), [[:Category:H01L21/8234|H01L21/8234]] (6 application
  27 KB (3,405 words) - 04:08, 4 December 2023
• Patent Applications Report for 10th Nov 2023
  ...egory:H01L29/66545|H01L29/66545]] (8 applications), [[:Category:H01L29/785|H01L29/785]] (7 applications) [[:Category:H01L29/66|H01L29/66]]: 72
  28 KB (3,504 words) - 04:04, 4 December 2023
• Patent Applications Report for 19th Jan 2024
  ...[:Category:H10B80/00|H10B80/00]] (13 applications), [[:Category:H01L29/775|H01L29/775]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications ...y:H01L29/06|H01L29/06]] (20 applications), [[:Category:H01L29/66795|H01L29/66795]] (20 applications)
  39 KB (4,876 words) - 09:02, 30 January 2024
• Patent Applications Report for 26th May 2023
  ...egory:H01L29/66795|H01L29/66795]] (6 applications), [[:Category:H01L29/423|H01L29/423]] (6 applications) ...[[:Category:H04W24/10|H04W24/10]] (4 applications), [[:Category:H01L29/423|H01L29/423]] (4 applications), [[:Category:H04W48/16|H04W48/16]] (4 applications),
  36 KB (4,410 words) - 03:45, 4 January 2024
• Patent Applications Report for 14th Apr 2023
  ...tegory:H01L27/092|H01L27/092]] (16 applications), [[:Category:H01L29/66545|H01L29/66545]] (16 applications) [[:Category:H01L29/66|H01L29/66]]: 60
  36 KB (4,381 words) - 18:22, 2 January 2024