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• US Patent Application 17872766. METHODS FOR EXTRUDING COARSE-GRAINED, LOW ALUMINUM CONTENT MAGNESIUM ALLOYS simplified abstract
  [[Category:C22F1/06]]
  2 KB (319 words) - 10:13, 4 December 2023
• Patent Applications Report for 12th May 2023
  ...1C23/00]] (1), [[:Category:B05B12/12|B05B12/12]] (1), [[:Category:C22F1/00|C22F1/00]] (1) ...ICS CO., LTD. has filed patents in the areas of [[:Category:G06F3/06|G06F3/06]] (24 applications), [[:Category:G06F3/0679|G06F3/0679]] (18 applications),
  36 KB (4,424 words) - 02:20, 3 January 2024
• Patent Applications Report for 6th Jan 2023
  ...areas of [[:Category:G06T1/60|G06T1/60]] (4), [[:Category:G06T15/06|G06T15/06]] (4), [[:Category:G06N3/08|G06N3/08]] (4), [[:Category:G06N20/00|G06N20/00 ...ensing, LLC has filed patents in the areas of [[:Category:H04L29/06|H04L29/06]] (4 applications), [[:Category:H04L67/10|H04L67/10]] (4 applications), [[:
  38 KB (4,652 words) - 00:59, 2 January 2024
• Patent Applications Report for 17th Feb 2023
  ...the areas of [[:Category:C22C21/02|C22C21/02]] (2), [[:Category:C22F1/043|C22F1/043]] (2) ...Category:G06F1/16|G06F1/16]] (14 applications), [[:Category:G06F3/06|G06F3/06]] (12 applications), [[:Category:H01L29/786|H01L29/786]] (10 applications),
  39 KB (4,793 words) - 04:41, 2 January 2024
• Patent Applications Report for 5th Apr 2024
  ...ry:H01L29/775|H01L29/775]] (16 applications), [[:Category:H01L29/06|H01L29/06]] (11 applications), [[:Category:H01L29/0673|H01L29/0673]] (10 applications ...gory:H01L29/66|H01L29/66]] (21 applications), [[:Category:H01L29/06|H01L29/06]] (17 applications), [[:Category:H01L29/775|H01L29/775]] (16 applications),
  48 KB (5,854 words) - 07:18, 12 April 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
  IPC Code(s): A63B24/00, A61H1/02, A61H3/00, A63B71/06, G09G3/00, G09G3/38 ...ory:A63B24/00]][[Category:A61H1/02]][[Category:A61H3/00]][[Category:A63B71/06]][[Category:G09G3/00]][[Category:G09G3/38]][[Category:samsung electronics c
  222 KB (34,040 words) - 07:20, 10 April 2024
• Blockchain patent applications on February 1st, 2024
  IPC Code(s): A24D1/02, A24D3/04, A24D3/06, A24D3/08 [[Category:A24D1/02]][[Category:A24D3/04]][[Category:A24D3/06]][[Category:A24D3/08]][[Category:Good Tree International, Inc.]]
  313 KB (44,738 words) - 04:14, 2 February 2024
• Blockchain patent applications on March 14th, 2024
  IPC Code(s): A01G31/06 [[Category:A01G31/06]][[Category:Sentient Design, Inc.]]
  369 KB (52,527 words) - 02:32, 20 March 2024