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• 3D Printing patent applications on May 30th, 2024
  IPC Code(s): B22F10/28, B22F1/054, B22F1/16, B33Y10/00, B33Y70/10 [[Category:B22F10/28]][[Category:B22F1/054]][[Category:B22F1/16]][[Category:B33Y10/00]][[Category:B33Y70/10]][[Category:Unknown Organiza
  11 KB (1,511 words) - 03:48, 10 June 2024
• Patent Applications Report for 17th Mar 2023
  ...ry:C25B11/065|C25B11/065]] (2 applications), [[:Category:C25B11/054|C25B11/054]] (2 applications) ...s), [[:Category:C02F1/66|C02F1/66]] (2 applications), [[:Category:B22F1/17|B22F1/17]] (2 applications)
  37 KB (4,476 words) - 06:16, 2 January 2024
• Patent Applications Report for 26th Jan 2024
  ...Category:C12N1/20|C12N1/20]] (2 applications), [[:Category:B22F1/054|B22F1/054]] (2 applications), [[:Category:B82Y30/00|B82Y30/00]] (2 applications), [[:
  45 KB (5,610 words) - 10:14, 30 January 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
  IPC Code(s): B23K35/02, B22F1/054, B22F1/142, B23K35/26, C22C12/00, C22C13/00, C22F1/16, C22F3/00, H01L23/00 ...y one metal element.[[Category:B23K35/02]][[Category:B22F1/054]][[Category:B22F1/142]][[Category:B23K35/26]][[Category:C22C12/00]][[Category:C22C13/00]][[Ca
  222 KB (34,040 words) - 07:20, 10 April 2024
• Blockchain patent applications on May 16th, 2024
  IPC Code(s): B28B1/00, B22F1/00, B22F1/05 [[Category:B28B1/00]][[Category:B22F1/00]][[Category:B22F1/05]][[Category:Cambria Company LLC]]
  299 KB (42,451 words) - 02:46, 23 May 2024
• Blockchain patent applications on February 1st, 2024
  IPC Code(s): B22F10/14, B22F1/10, B22F12/86, B22F10/66, B22F12/50, B33Y10/00, B33Y40/20, B33Y70/10 [[Category:B22F10/14]][[Category:B22F1/10]][[Category:B22F12/86]][[Category:B22F10/66]][[Category:B22F12/50]][[Cat
  313 KB (44,738 words) - 04:14, 2 February 2024