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  • =SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE= ==SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==
    4 KB (634 words) - 04:11, 16 April 2024
  • ..., TERMINAL, AND STORAGE MEDIUM simplified abstract (SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY)]] ...ADVANCED TECHNOLOGY, QI YANG of Shenzhen (CN) for SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY
    39 KB (4,880 words) - 03:14, 2 January 2024
  • ...as: layer, die, circuit, surface, coupled, structure, substrate, package, semiconductor, signal in their patent application abstracts. With keywords such as: semiconductor, device, data, least, region, processor, computer, program, user, circuit i
    38 KB (4,598 words) - 11:03, 5 January 2024
  • With keywords such as: device, data, memory, layer, substrate, semiconductor, least, structure, die, circuitry in their patent application abstracts. With keywords such as: die, layer, semiconductor, coupled, having, output, input, current, surface, transistor in their pate
    38 KB (4,550 words) - 01:48, 3 January 2024
  • With keywords such as: layer, device, including, semiconductor, substrate, data, based, region, information, pattern in their patent appli ...LTD.]]: 53 patent applications[[Category:WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.]]
    45 KB (5,610 words) - 10:14, 30 January 2024
  • ...patent applications cover cutting-edge technologies in display technology, semiconductor design, mobile communication, and smart home solutions, driving innovation ...healthcare innovations, including drug discovery, vaccine development, and advanced drug delivery systems. Merck’s patents support its commitment to addressi
    34 KB (4,229 words) - 03:18, 10 June 2024
  • ...OR MANUFACTURING COMPANY, LTD.]]: 117 patent applications[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]] TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. has filed patents in the areas of [[:Category:H
    37 KB (4,531 words) - 10:00, 7 December 2023
  • With keywords such as: semiconductor, device, portion, unit, circuit, surface, information, vehicle, time, senso ...ia Corporation]] and [[:Category:Korea Advanced Institute of Science|Korea Advanced Institute of Science]]: 2 patent applications.
    35 KB (4,393 words) - 06:05, 4 January 2024
  • ...nductor Manufacturing Co., Ltd.]]: 64 patent applications[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]] Taiwan Semiconductor Manufacturing Co., Ltd. has filed patents in the areas of [[:Category:H01L2
    39 KB (4,888 words) - 04:21, 2 January 2024
  • With keywords such as: device, configured, based, information, semiconductor, including, surface, substrate, layer, structure in their patent applicatio ...tor Manufacturing Company, Ltd.]]: 35 patent applications[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]
    48 KB (5,904 words) - 09:33, 12 April 2024
  • ...data, based, information, including, communication, configured, substrate, semiconductor in their patent application abstracts. ...tor Manufacturing Company, Ltd.]]: 70 patent applications[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]
    46 KB (5,558 words) - 04:10, 9 February 2024
  • ...NDUCTOR MANUFACTURING CO., LTD.]]: 90 patent applications[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.]] TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. has filed patents in the areas of [[:Category:H01L2
    38 KB (4,677 words) - 01:14, 2 January 2024
  • With keywords such as: layer, device, substrate, information, semiconductor, including, configured, based, structure, surface in their patent applicati ...nductor Manufacturing Co., Ltd.]]: 67 patent applications[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]
    46 KB (5,621 words) - 06:41, 2 February 2024
  • ...s such as: device, layer, based, configured, including, memory, substrate, semiconductor, electronic, data in their patent application abstracts. With keywords such as: memory, device, data, material, semiconductor, include, cells, die, read, conductive in their patent application abstract
    45 KB (5,535 words) - 03:18, 4 March 2024
  • * Structural engineering: The tuned mass damper can be used to reduce vibrations in tall buildings, * Industrial and engineering applications
    140 KB (20,080 words) - 16:54, 1 January 2024
  • ...AND METHOD FOR POLISHING FIBER OPTIC CONNECTOR simplified abstract (Senko Advanced Components, Inc.)]] Organization: Senko Advanced Components, Inc.
    313 KB (44,738 words) - 04:14, 2 February 2024
  • [[20240058103. NANOFIBROUS TISSUE ENGINEERING MATRICES WITH IMPROVED CLINICAL HANDLING PROPERTIES FOR PERIODONTAL AND CRA [[20240059829. EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PR
    281 KB (40,348 words) - 07:08, 22 February 2024
  • ...PANDABLE STRUCTURES AND ROTATABLE SHAFTS simplified abstract (Endovascular Engineering, Inc.)]] Organization: Endovascular Engineering, Inc.
    254 KB (36,510 words) - 03:59, 19 March 2024
  • [[RE-LID ENGINEERING AG (20240116670). CLOSURE SYSTEM FOR CONTAINERS simplified abstract]] Organization: RE-LID ENGINEERING AG
    292 KB (41,747 words) - 07:04, 12 April 2024
  • [[Acorn Engineering Company (20240090665). LIGATURE RESISTANT CABINET simplified abstract]] Organization: Acorn Engineering Company
    354 KB (50,663 words) - 09:14, 21 March 2024

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