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Show new changes starting from 14:00, 9 June 2024
   
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6 June 2024

N    05:55  18368128. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)‎ diffhist +4,247‎ Wikipatents talk contribs Creating a new page
N    05:55  18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)‎ diffhist +3,745‎ Wikipatents talk contribs Creating a new page
N    05:40  18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)‎ diffhist +3,946‎ Wikipatents talk contribs Creating a new page
N    05:40  18435628. UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY simplified abstract (Lodestar Licensing Group LLC)‎ diffhist +4,076‎ Wikipatents talk contribs Creating a new page
N    05:35  18523007. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE simplified abstract (STMicroelectronics International N.V.)‎ diffhist +4,314‎ Wikipatents talk contribs Creating a new page
N    04:50  18092081. CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRONIC DEVICES simplified abstract (Yangtze Memory Technologies Co., Ltd.)‎ diffhist +4,636‎ Wikipatents talk contribs Creating a new page
N    04:42  18353621. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +3,828‎ Wikipatents talk contribs Creating a new page
N    02:33  18432788. SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract (SK hynix Inc.)‎ diffhist +2,956‎ Wikipatents talk contribs Creating a new page
N    02:22  18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +3,527‎ Wikipatents talk contribs Creating a new page
N    02:21  18167081. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,477‎ Wikipatents talk contribs Creating a new page
N    02:18  18435822. APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract (Micron Technology, Inc.)‎ diffhist +3,379‎ Wikipatents talk contribs Creating a new page
N    02:18  18497559. ETCH-BACK OPENING WITH PROTECTIVE FILL STRUCTURE simplified abstract (Micron Technology, Inc.)‎ diffhist +3,829‎ Wikipatents talk contribs Creating a new page
N    02:11  18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)‎ diffhist +4,775‎ Wikipatents talk contribs Creating a new page
N    02:11  18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)‎ diffhist +3,926‎ Wikipatents talk contribs Creating a new page
N    02:10  18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)‎ diffhist +3,493‎ Wikipatents talk contribs Creating a new page
N    01:21  18430903. CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)‎ diffhist +4,283‎ Wikipatents talk contribs Creating a new page
N    01:21  18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)‎ diffhist +3,745‎ Wikipatents talk contribs Creating a new page
N    00:44  18489224. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +3,884‎ Wikipatents talk contribs Creating a new page
N    00:44  18355718. SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,092‎ Wikipatents talk contribs Creating a new page
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