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Show new changes starting from 12:32, 3 June 2024
   
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31 May 2024

N    08:44  18378182. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,558‎ Wikipatents talk contribs Creating a new page
N    08:44  18382546. SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,378‎ Wikipatents talk contribs Creating a new page
N    08:10  Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024‎ diffhist +71,991‎ Wikipatents talk contribs Creating a new page
N    08:10  Taiwan semiconductor manufacturing company, ltd. (20240179923). SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract‎ diffhist +3,508‎ Wikipatents talk contribs Creating a new page
N    08:08  Taiwan semiconductor manufacturing company, ltd. (20240178228). SEMICONDUCTOR DEVICE AND LOGIC DEVICE simplified abstract‎ diffhist +3,872‎ Wikipatents talk contribs Creating a new page
N    08:07  Taiwan semiconductor manufacturing company, ltd. (20240178139). APPARATUS AND METHODS FOR GENERATING A CIRCUIT WITH HIGH DENSITY ROUTING LAYOUT simplified abstract‎ diffhist +4,201‎ Wikipatents talk contribs Creating a new page
N    08:06  Taiwan semiconductor manufacturing company, ltd. (20240178132). VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract‎ diffhist +4,349‎ Wikipatents talk contribs Creating a new page
N    08:06  Taiwan semiconductor manufacturing company, ltd. (20240178091). Integrated Circuit Package and Method simplified abstract‎ diffhist +4,283‎ Wikipatents talk contribs Creating a new page
N    07:57  Intel Corporation patent applications on May 30th, 2024‎ diffhist +62,684‎ Wikipatents talk contribs Creating a new page
N    07:54  Intel corporation (20240178071). DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract‎ diffhist +4,871‎ Wikipatents talk contribs Creating a new page
N    07:51  INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024‎ diffhist +74,925‎ Wikipatents talk contribs Creating a new page
N    07:49  International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract‎ diffhist +4,737‎ Wikipatents talk contribs Creating a new page
N    07:49  International business machines corporation (20240178142). LATE MIDDLE-OF-LINE GATE CUT WITH POWER BAR FORMATION simplified abstract‎ diffhist +4,357‎ Wikipatents talk contribs Creating a new page
N    07:49  International business machines corporation (20240178136). LOCAL INTERCONNECT FORMATION AT DOUBLE DIFFUSION BREAK simplified abstract‎ diffhist +4,516‎ Wikipatents talk contribs Creating a new page
N    07:48  International business machines corporation (20240178127). ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract‎ diffhist +3,888‎ Wikipatents talk contribs Creating a new page
N    07:48  International business machines corporation (20240178050). ADJACENT BURIED POWER RAIL FOR STACKED FIELD-EFFECT TRANSISTOR ARCHITECTURE simplified abstract‎ diffhist +4,544‎ Wikipatents talk contribs Creating a new page
N    06:32  Samsung Electronics Co., Ltd. patent applications on May 30th, 2024‎ diffhist +232,227‎ Wikipatents talk contribs Creating a new page
N    06:21  Samsung electronics co., ltd. (20240178138). SEMICONDUCTOR DEVICE simplified abstract‎ diffhist +4,193‎ Wikipatents talk contribs Creating a new page
N    06:21  Samsung electronics co., ltd. (20240178131). SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract‎ diffhist +4,149‎ Wikipatents talk contribs Creating a new page
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