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31 May 2024
N 08:45 | 18357484. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.) diffhist +3,527 Wikipatents talk contribs Creating a new page |
N 08:10 | Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024 diffhist +71,991 Wikipatents talk contribs Creating a new page |
N 08:06 | Taiwan semiconductor manufacturing company, ltd. (20240178095). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract diffhist +4,581 Wikipatents talk contribs Creating a new page |
N 07:57 | Intel Corporation patent applications on May 30th, 2024 diffhist +62,684 Wikipatents talk contribs Creating a new page |
N 07:54 | Intel corporation (20240178097). PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract diffhist +3,905 Wikipatents talk contribs Creating a new page |
N 06:32 | Samsung Electronics Co., Ltd. patent applications on May 30th, 2024 diffhist +232,227 Wikipatents talk contribs Creating a new page |
N 06:22 | Samsung electronics co., ltd. (20240178185). SEMICONDUCTOR PACKAGE simplified abstract diffhist +3,684 Wikipatents talk contribs Creating a new page |