Seiko epson corporation (20240109355). Liquid Discharge Apparatus And Liquid Discharge Module simplified abstract
Contents
- 1 Liquid Discharge Apparatus And Liquid Discharge Module
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Liquid Discharge Apparatus And Liquid Discharge Module - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Liquid Discharge Apparatus And Liquid Discharge Module
Organization Name
Inventor(s)
Masahiko Tsuyuki of Chino (JP)
Makoto Takamuku of Matsumoto (JP)
Liquid Discharge Apparatus And Liquid Discharge Module - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240109355 titled 'Liquid Discharge Apparatus And Liquid Discharge Module
Simplified Explanation
The liquid discharge apparatus described in the patent application includes a first substrate with a front and back surface, a second substrate with a front and back surface, electronic components on each substrate, a cooling fan, and heat sinks attached to each substrate.
- The apparatus consists of two substrates, each with electronic components on the front surface.
- A cooling fan generates an air flow in a gas flow path created by the front surfaces of the substrates.
- Heat sinks are attached to each substrate to dissipate heat generated by the electronic components.
Potential Applications
The technology described in this patent application could be used in various liquid discharge systems, such as inkjet printers, 3D printers, and industrial liquid dispensing systems.
Problems Solved
This technology solves the problem of overheating electronic components in liquid discharge systems, which can lead to malfunctions and reduced lifespan of the equipment.
Benefits
The benefits of this technology include improved performance and reliability of liquid discharge systems, longer lifespan of electronic components, and more efficient cooling mechanisms.
Potential Commercial Applications
Potential commercial applications of this technology include manufacturing companies producing inkjet printers, 3D printers, and other liquid discharge systems for industrial use.
Possible Prior Art
One possible prior art for this technology could be liquid cooling systems used in computer processors to dissipate heat generated by the components.
Unanswered Questions
=== How does the size and design of the cooling fan impact the efficiency of the cooling system in the liquid discharge apparatus? The patent application does not provide specific details on the size and design of the cooling fan, which could impact the overall efficiency of the cooling system. Further research or experimentation would be needed to determine the optimal specifications for the cooling fan.
=== Are there any potential drawbacks or limitations to using heat sinks in the liquid discharge apparatus? The patent application does not mention any potential drawbacks or limitations of using heat sinks in the liquid discharge apparatus. It would be important to investigate if there are any issues related to heat dissipation or compatibility with other components in the system.
Original Abstract Submitted
there is provide a liquid discharge apparatus including: a first substrate including a first substrate front surface and a first substrate back surface opposite to the first substrate front surface; a second substrate including a second substrate front surface and a second substrate back surface opposite to the second substrate front surface; a first circuit having a first electronic component provided on the first substrate front surface; a second circuit having a second electronic component provided on the second substrate front surface; a cooling fan that generates an air flow in a gas flow path configured by the first substrate front surface and the second substrate front surface; a first heat sink attached to the first substrate; and a second heat sink attached to the second substrate.
