Seiko epson corporation (20240109258). METHOD OF MANUFACTURING LIQUID EJECTING HEAD simplified abstract
Contents
- 1 METHOD OF MANUFACTURING LIQUID EJECTING HEAD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING LIQUID EJECTING HEAD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this method compare to traditional bonding techniques in terms of strength and durability?
- 1.11 What materials are used for the components and adhesive in this method?
- 1.12 Original Abstract Submitted
METHOD OF MANUFACTURING LIQUID EJECTING HEAD
Organization Name
Inventor(s)
Fumiya Takino of SHIOJIRI-SHI (JP)
METHOD OF MANUFACTURING LIQUID EJECTING HEAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240109258 titled 'METHOD OF MANUFACTURING LIQUID EJECTING HEAD
Simplified Explanation
The method described in the abstract involves manufacturing a liquid ejecting head by heating an adhesive to bond and cure components together, disassembling the components after heating to release the bond, and then replacing at least one component with a new product.
- Heating step: The adhesive is heated to plasticize and bond the components together.
- Disassembling step: The bond between the components is released after heating.
- Replacing step: At least one component is replaced with a new product after disassembling.
Potential Applications
The technology could be applied in the manufacturing of various liquid ejecting devices such as inkjet printers, 3D printers, and industrial printing machines.
Problems Solved
This method allows for easy disassembly and replacement of components in liquid ejecting heads, facilitating maintenance and repair processes.
Benefits
- Simplified manufacturing process - Improved maintenance and repair capabilities - Cost-effective component replacement
Potential Commercial Applications
"Cost-Effective Component Replacement in Liquid Ejecting Heads"
Possible Prior Art
There may be prior art related to methods of bonding and disassembling components in liquid ejecting heads, but specific examples are not provided in the abstract.
Unanswered Questions
How does this method compare to traditional bonding techniques in terms of strength and durability?
The abstract does not provide information on the strength and durability of the bond created by this method compared to traditional bonding techniques.
What materials are used for the components and adhesive in this method?
The abstract does not specify the materials used for the components and adhesive, which could impact the overall performance and longevity of the liquid ejecting head.
Original Abstract Submitted
a method of manufacturing a liquid ejecting head including a first component and a second component, the method includes a heating step of heating an adhesive that bonds and cures the first component and the second component to plasticize the adhesive, a disassembling step of releasing a bonding state between the first component and the second component by the heating step, and a replacing step of replacing at least one of the first component and the second component with a new product after the disassembling step.
