Samsung electronics co., ltd. (20240136718). MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME simplified abstract
Contents
MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME
Organization Name
Inventor(s)
Gennadiy Aleksandrovich Evtyushkin of Moscow (RU)
Elena Aleksandrovna Shepeleva of Moscow (RU)
Anton Sergeevich Lukyanov of Moscow (RU)
MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136718 titled 'MM-WAVE RESONANT TERMINATION LOAD EMBEDDED IN A PCB SUBSTRATE AND ANTENNA ARRAY INCLUDING THE SAME
Simplified Explanation
The disclosure pertains to a termination load embedded in a printed circuit board substrate and an antenna array including the termination load. The termination load is designed to reduce complexity and size, increase reliability, and improve the speed of wireless data transmission in antenna arrays.
- The termination load embedded in the printed circuit board substrate includes a fragment of at least one feeding line, a transitional patch, a top resonator patch, and a top metal ground layer coplanar with the top patch. A resistive material is placed in a gap between the top resonator patch and the top metal layer. The feeding line terminates in the termination load in the form of an excitation probe, with the feeding line located between the bottom ground layer and the top layer of the printed circuit board.
Potential Applications: - Wireless communication systems - Antenna arrays for data transmission
Problems Solved: - Complexity and size of termination loads - Reliability and speed of wireless data transmission
Benefits: - Increased reliability - Reduced complexity and size - Improved speed of data transmission
Potential Commercial Applications: - Telecommunications industry - IoT devices
Possible Prior Art: There are existing termination loads and antenna arrays in the field of radio engineering, but the specific design and configuration described in this disclosure may be novel.
Unanswered Questions: 1. How does the resistive material in the termination load impact the performance of the antenna array? 2. Are there any specific standards or regulations that this innovation needs to comply with in order to be used in commercial products?
Original Abstract Submitted
the disclosure relates to radio engineering, for example to a termination load embedded in a printed circuit board substrate and an antenna array including the termination load. the disclosure reduces the complexity and size and increases the reliability of the termination load, as well as in increasing the reliability and speed of wireless data transmission in antenna arrays that use the termination loads. the termination load embedded in the printed circuit board substrate comprises: a fragment of at least one feeding line, a transitional patch, a top resonator patch, a top metal ground layer coplanar with the top patch, wherein a resistive material is disposed in a gap between the top resonator patch and the top metal layer, said fragment of the at least one feeding line terminates in the termination load in the form of an excitation probe, said at least one feeding line is located in the printed circuit board between the bottom ground layer of the printed circuit board and the top layer of the printed circuit board, in which the top resonator patch, the resistive material and the top metal layer are located, the transitional patch is located in the printed circuit board between the layer in which at least one feeding line is located and said top layer, the excitation probe, the transitional patch and the top resonator patch are coupled to each other by electromagnetic coupling.
