Samsung electronics co., ltd. (20240136341). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136341 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a first redistribution wiring layer with two surfaces, a connection layer, two semiconductor chips mounted on the first redistribution wiring layer, a molding member, and a second redistribution wiring layer connected to the first redistribution wiring layer through through electrodes.
- The semiconductor package includes a first redistribution wiring layer with two surfaces, a connection layer, two semiconductor chips, a molding member, and a second redistribution wiring layer.
- The first semiconductor chip is mounted on the first chip mounting region, while the second semiconductor chip is spaced apart on the second chip mounting region and includes through electrodes.
- The second redistribution wiring layer is electrically connected to the first redistribution wiring layer through the through electrodes.
Potential Applications
This technology could be applied in:
- Advanced electronic devices
- High-performance computing systems
- Communication equipment
Problems Solved
This technology helps in:
- Increasing circuit density
- Improving electrical connections
- Enhancing overall performance
Benefits
The benefits of this technology include:
- Enhanced functionality
- Improved reliability
- Compact design
Potential Commercial Applications
This technology could find commercial applications in:
- Semiconductor manufacturing industry
- Electronics market
- Research and development sector
Possible Prior Art
One possible prior art for this technology could be the use of similar semiconductor packaging techniques in the semiconductor industry.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison with existing semiconductor packaging methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.
What are the specific materials used in the molding member and how do they contribute to the overall performance of the semiconductor package?
The article does not delve into the details of the materials used in the molding member and their impact on the semiconductor package's performance, leaving this aspect open for further exploration.
Original Abstract Submitted
a semiconductor package, comprising: a first redistribution wiring layer including first and second surfaces opposite to each other, wherein the first redistribution wiring layer includes a first chip mounting region and a second chip mounting region adjacent to the first chip mounting region; a connection layer on the first surface of the first redistribution wiring layer; a first semiconductor chip on the first chip mounting region on the connection layer; a second semiconductor chip spaced apart from the first semiconductor chip on the second chip mounting region on the connection layer, wherein the second semiconductor chip includes through electrodes; a molding member on the first and second semiconductor chips on the connection layer; and a second redistribution wiring layer on the molding member, wherein the second redistribution wiring layer is electrically connected to the first redistribution wiring layer through the through electrodes.
