Samsung electronics co., ltd. (20240136340). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Heejung Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136340 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a package structure for semiconductor chips, including through-vias passing through encapsulants. The structure involves multiple layers of redistribution structures and encapsulants, with through-vias connecting the layers.
- The package structure includes:
- First redistribution structure
- At least one first semiconductor chip
- First encapsulant covering the chip
- First through-via passing through the encapsulant
- Second redistribution structure
- At least one second semiconductor chip
- Second encapsulant covering the chip
- Second through-via passing through the encapsulant
- The second package structure is disposed on the first package structure.
- At least one of the through-vias is positioned between non-active surfaces.
Potential Applications
The technology can be applied in the semiconductor industry for packaging and interconnecting multiple chips in a compact and efficient manner.
Problems Solved
The package structure solves the problem of efficiently connecting multiple semiconductor chips in a compact space while maintaining structural integrity and electrical connectivity.
Benefits
- Improved packaging density
- Enhanced electrical connectivity
- Structural integrity
Potential Commercial Applications
- High-performance computing
- Telecommunications
- Automotive electronics
Possible Prior Art
Prior art may include traditional semiconductor packaging methods involving wire bonding or flip-chip technology.
Unanswered Questions
How does the package structure impact the overall performance of the semiconductor device?
The article does not delve into the specific performance enhancements or limitations of the package structure on the semiconductor device.
What are the potential challenges in manufacturing the described package structure at scale?
The article does not address the potential manufacturing challenges or limitations that may arise when producing the package structure in large quantities.
Original Abstract Submitted
a first package structure including a first redistribution structure, at least one first semiconductor chip disposed on the first redistribution structure, a first encapsulant covering the at least one first semiconductor chip, and a first through-via passing through the first encapsulant; a second package structure including a second redistribution structure, at least one second semiconductor chip disposed on the second redistribution structure, a second encapsulant covering the at least one second semiconductor chip, and a second through-via passing through the second encapsulant. the second package structure is disposed on the first package structure. at least one of a first upper end of the first through-via or a second upper end of the second through-via is between a first non-active surface and a second non-active surface.
