Samsung electronics co., ltd. (20240136321). SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract
Contents
- 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING EQUIPMENT
Organization Name
Inventor(s)
SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136321 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT
Simplified Explanation
The patent application describes semiconductor manufacturing equipment with a bonding head, a head heater with a thermal compression surface and negative pressure channels, and a bonding tool with grooves for thermal compression of a semiconductor chip.
- The equipment includes a bonding head with a head heater at the bottom, which has a thermal compression surface and negative pressure channels with holes for improved thermal compression.
- The bonding tool has grooves on one surface to enhance contact with the thermal compression surface of the head heater, while the opposite surface contacts the semiconductor chip for thermal compression.
Potential Applications
This technology could be used in semiconductor manufacturing processes that require precise thermal compression bonding of semiconductor chips.
Problems Solved
This technology solves the problem of achieving uniform and efficient thermal compression bonding in semiconductor manufacturing equipment.
Benefits
The benefits of this technology include improved thermal compression bonding performance, increased efficiency in semiconductor manufacturing processes, and potentially higher quality semiconductor products.
Potential Commercial Applications
A potential commercial application for this technology could be in the production of advanced semiconductor devices for various industries such as electronics, telecommunications, and automotive.
Possible Prior Art
One possible prior art for this technology could be existing semiconductor manufacturing equipment with similar features for thermal compression bonding processes.
Unanswered Questions
How does this technology compare to existing bonding equipment in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and existing bonding equipment in terms of efficiency and performance.
What are the potential limitations or challenges in implementing this technology in semiconductor manufacturing processes?
This article does not address the potential limitations or challenges in implementing this technology in semiconductor manufacturing processes.
Original Abstract Submitted
semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.
