Samsung electronics co., ltd. (20240136307). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136307 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor chip with a chip pad and a support pad, a wiring substrate with a support bonding on trace (bot) pad, and a dummy area. The support bump is connected to the support pad, and the support bot pad is bonded to the support bump.
- Semiconductor chip with chip pad and support pad:
- The semiconductor chip has a chip pad located on the first surface and a support pad positioned on the first surface, spaced apart from the chip pad.
- Wiring substrate with support bonding on trace (bot) pad and dummy area:
- The wiring substrate is disposed to face the semiconductor substrate and includes a support bot pad bonded to the support bump. Additionally, there is a dummy area on the wiring substrate spaced apart from the support bot pad.
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- Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, and computers.
- Problems Solved
This technology helps in improving the reliability and performance of semiconductor packages by providing a secure connection between the semiconductor chip and the wiring substrate.
- Benefits
- Enhanced reliability of semiconductor packages - Improved performance of electronic devices
- Potential Commercial Applications
Optimizing Semiconductor Package Design for Enhanced Performance
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- Possible Prior Art
One possible prior art could be the use of support pads and support bumps in semiconductor packages to improve the connection between the chip and the wiring substrate.
- Unanswered Questions
- How does this technology compare to existing semiconductor package designs?
This article does not provide a direct comparison with existing semiconductor package designs in terms of performance, reliability, and cost-effectiveness.
- What are the specific electronic devices that could benefit the most from this technology?
The article does not specify the electronic devices that could benefit the most from this technology, leaving room for further exploration and analysis.
Original Abstract Submitted
a semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (bot) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support bot pad.
