Samsung electronics co., ltd. (20240136290). SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
Jee Woong Kim of Suwon-si (KR)
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136290 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Simplified Explanation
The semiconductor device described in the patent application includes a substrate with an electronic device, interlayer insulating layers, frontside and backside wiring structures, and unit chains connecting the electronic device with the backside wiring structure through through plugs, connection contacts, and chain plugs.
- Simplified Explanation:
- Semiconductor device with improved performance and simple design. - Includes substrate, electronic device, insulating layers, wiring structures, and unit chains. - Unit chains connect electronic device with backside wiring structure through plugs and chain plugs.
- Potential Applications:
- Integrated circuits - Microprocessors - Memory devices
- Problems Solved:
- Complex wiring structures - Performance limitations - Fabrication challenges
- Benefits:
- Improved performance - Simplified design - Enhanced reliability
- Potential Commercial Applications:
- Electronics industry - Semiconductor manufacturing - Consumer electronics
- Possible Prior Art:
- Previous semiconductor devices with complex wiring structures - Older methods of connecting electronic devices to wiring structures
- Unanswered Questions:
1. How does the unit chain design impact the overall efficiency of the semiconductor device? 2. What specific materials are used in the fabrication of the through plugs and chain plugs for optimal performance?
Original Abstract Submitted
a semiconductor device having simplicity in design and improved performance and methods for fabricating the same are provided. the semiconductor device includes a substrate including a frontside and a backside opposite the frontside, an electronic device on the frontside of the substrate, an interlayer insulating layer covering the electronic device, a frontside wiring structure on the interlayer insulating layer, a backside wiring structure on the backside of the substrate, and at least one unit chain connecting the electronic device with the backside wiring structure, the unit chain including a through plug passing through the substrate, a connection contact on the interlayer insulating layer, a first chain plug passing through the interlayer insulating layer to connect the through plug with the connection contact, and a second chain plug passing through the interlayer insulating layer to be connected to the through plug.
