Samsung electronics co., ltd. (20240136272). SEMICONDUCTOR PACKAGES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136272 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a front redistribution structure with multiple redistribution layers, connection bumps, and an underfill material within a recess.
- The front redistribution structure consists of an insulating layer with front redistribution layers on different levels, including an inner and outer redistribution layer.
- Connection bumps are present within the recess, with one bump connected to the first redistribution layer and another bump connected to the outer redistribution layer.
- The underfill material extends along the side surfaces of the connection bumps and the dam within the recess.
Potential Applications
The technology described in this semiconductor package could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in improving the electrical connections within semiconductor packages, enhancing the overall performance and reliability of electronic devices.
Benefits
- Improved electrical connections - Enhanced performance and reliability of electronic devices - Better heat dissipation
Potential Commercial Applications
"Enhancing Electrical Connections in Semiconductor Packages for Improved Device Performance"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques, such as flip-chip technology or wire bonding methods.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison with other semiconductor packaging methods, leaving the reader to wonder about the specific advantages of this technology over existing ones.
What are the specific electronic devices that could benefit the most from this technology?
The article mentions potential applications in consumer electronics, but it does not delve into the specific devices that could see the most significant improvements from implementing this semiconductor package design.
Original Abstract Submitted
a semiconductor package including: a front redistribution structure including an insulating layer defining an upper surface, a lower surface opposing the upper surface, and a side surface, front redistribution layers including a first redistribution layer on a first level adjacent to the lower surface and second redistribution layers on a second level higher than the first level relative to the lower surface, the second redistribution layers having an inner redistribution layer and an outer redistribution layer, a recess exposing at least a portion of the outer redistribution layer, and a dam on at least one side of the recess; connection bumps including a first bump electrically connected to the first redistribution layer and a second bump electrically connected to the outer redistribution layer within the recess; and an underfill that extends along a side surface of the second bump and a side surface of the dam within the recess.
