Samsung electronics co., ltd. (20240136271). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
KEUNYOUNG Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136271 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes a substrate with a pattern layer on one surface, containing pads and a plating wire. A protection layer covers the pattern layer, exposing the pads while physically separating at least one pad from the plating wire.
- Explanation of the patent:
- Substrate with pattern layer containing pads and plating wire - Protection layer covering pattern layer and exposing pads - Physical separation of at least one pad from plating wire
Potential Applications
The technology described in this patent application could be applied in: - Semiconductor manufacturing - Electronic device packaging - Integrated circuit design
Problems Solved
This technology helps to: - Prevent short circuits between pads and plating wire - Improve reliability and performance of semiconductor packages - Enhance overall product quality
Benefits
The benefits of this technology include: - Increased durability and longevity of semiconductor packages - Enhanced electrical connectivity and signal transmission - Improved manufacturing efficiency and cost-effectiveness
Potential Commercial Applications
The potential commercial applications of this technology could be in: - Consumer electronics - Automotive electronics - Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be: - Existing semiconductor packaging methods - Traditional wire bonding techniques
Unanswered Questions
What is the manufacturing cost of implementing this technology?
The patent application does not provide information on the cost implications of using this technology. Further research or analysis would be needed to determine the manufacturing cost.
How does this technology compare to existing packaging methods in terms of performance and reliability?
The patent application does not directly compare this technology to existing packaging methods. Comparative studies or testing would be necessary to evaluate the performance and reliability of this technology against others.
Original Abstract Submitted
a semiconductor package includes a substrate. a pattern layer is disposed on a first surface of the substrate. the pattern layer includes a plurality of pads and a plating wire positioned between adjacent pads of the plurality of pads. a first protection layer is disposed on the first surface of the substrate to cover the pattern layer and expose the plurality of pads. at least one pad of the plurality of pads is physically separated from the plating wire.
