Samsung electronics co., ltd. (20240136262). SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
DONGHYEON Jang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136262 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Simplified Explanation
The present disclosure relates to a semiconductor package and a manufacturing method thereof. The manufacturing method includes preparing a glass substrate with a groove and a hole, filling the hole with a conductive connection member, attaching a semiconductor chip inside the groove, forming redistribution structures on both sides of the glass substrate for connection with the semiconductor chip and the conductive connection member.
- Glass substrate with groove and hole
- Conductive connection member filling the hole
- Semiconductor chip attached inside the groove
- First redistribution structure on one side of the glass substrate
- Second redistribution structure on the other side of the glass substrate
Potential Applications
The technology can be applied in various semiconductor packaging applications where a high level of integration and miniaturization is required.
Problems Solved
This technology solves the problem of achieving a compact and efficient semiconductor package design with improved connectivity and reliability.
Benefits
The benefits of this technology include enhanced performance, increased reliability, and reduced size of semiconductor packages.
Potential Commercial Applications
Potential commercial applications of this technology include consumer electronics, automotive electronics, medical devices, and industrial equipment.
Possible Prior Art
One possible prior art could be the use of traditional semiconductor packaging methods involving ceramic or plastic substrates.
Unanswered Questions
1. What specific materials are used for the glass substrate and the conductive connection member in this manufacturing method? 2. How does the formation of the redistribution structures contribute to the overall performance of the semiconductor package?
Original Abstract Submitted
the present disclosure relates to a semiconductor package and a manufacturing method thereof, and a manufacturing method of a semiconductor package according to an embodiment includes: preparing a glass substrate that includes a groove and a hole positioned around the groove; forming a conductive connection member to fill inside the hole of the glass substrate; attaching a semiconductor chip inside the groove of the glass substrate; forming a first redistribution structure for connection with the semiconductor chip and the conductive connection member on a first side of the glass substrate; and forming a second redistribution structure for connection with the conductive connection member on a second side of the glass substrate.
