Samsung electronics co., ltd. (20240136261). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEUNGWAN Shin of Suwon-si (KR)
JUNGHOON Kang of Suwon-si (KR)
JUNG HYUN Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136261 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a molding material encapsulating the semiconductor chip and the first redistribution substrate, and a second redistribution substrate on top of the molding material. The second redistribution substrate consists of at least one redistribution line, a metal pad, and a dielectric layer covering the redistribution line and the metal pad, with a marking region on the metal pad and multiple concave portions on the metal pad.
- First redistribution substrate
- Semiconductor chip
- Molding material
- Second redistribution substrate
* Redistribution line * Metal pad * Dielectric layer * Marking region * Concave portions
Potential Applications
The technology can be applied in the manufacturing of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This technology helps in improving the performance and reliability of semiconductor packages by providing efficient redistribution of signals and power within the package.
Benefits
- Enhanced signal transmission - Improved power distribution - Increased reliability of semiconductor packages
Potential Commercial Applications
Optimizing Semiconductor Package Design for Improved Performance
Possible Prior Art
Prior art may include similar semiconductor packaging technologies involving redistribution substrates and molding materials.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions?
This article does not provide a direct comparison with existing semiconductor packaging solutions, leaving the reader to wonder about the specific advantages of this technology over others.
What are the specific electronic devices that could benefit the most from this technology?
The article does not specify the electronic devices that could benefit the most from this technology, leaving room for speculation on its targeted applications.
Original Abstract Submitted
a semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the molding material, wherein the second redistribution substrate includes: at least one redistribution line; a metal pad; and a dielectric layer molding the at least one redistribution line and the metal pad, wherein the dielectric layer includes a marking region on the metal pad, and the metal pad includes a plurality of concave portions.
