Samsung electronics co., ltd. (20240136255). INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
Contents
- 1 INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136255 titled 'INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The integrated circuit device described in the patent application includes a first semiconductor chip, signal through silicon vias (TSVs), a second semiconductor chip, signal bumps, and an interposer. The TSVs are located in the first semiconductor chip with a first pitch, while the second semiconductor chip is positioned on top of the first semiconductor chip. The signal bumps are on the lower surface of the second semiconductor chip with a second pitch wider than the first pitch. The interposer is placed between the first and second semiconductor chips, electrically connecting the TSVs with the signal bumps. This configuration reduces the area occupied by the TSVs in the first semiconductor chip, resulting in a smaller overall size for the integrated circuit device.
- TSVs in first semiconductor chip with smaller pitch
- Second semiconductor chip on top of first chip with signal bumps on lower surface with wider pitch
- Interposer connecting TSVs with signal bumps to reduce area occupied by TSVs
Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, and laptops where space-saving and high-performance integrated circuits are required.
Problems Solved
This technology solves the problem of limited space in integrated circuit devices by reducing the area occupied by signal TSVs, allowing for a smaller overall size without compromising performance.
Benefits
The main benefit of this technology is the ability to create more compact and efficient integrated circuit devices without sacrificing functionality or performance.
Potential Commercial Applications
A potential commercial application for this technology could be in the consumer electronics industry, where smaller and more efficient devices are in high demand.
Possible Prior Art
One possible prior art for this technology could be the use of interposers in integrated circuit devices to improve connectivity and reduce size. However, the specific configuration described in this patent application, with the combination of TSVs, signal bumps, and interposer, may be a novel approach to addressing the space-saving challenges in integrated circuit design.
Unanswered Questions
How does this technology impact power consumption in integrated circuit devices?
The patent application does not provide information on how this technology affects power consumption in integrated circuit devices. It would be interesting to know if the reduced size and improved connectivity have any impact on power efficiency.
Are there any limitations to the size reduction achieved with this technology?
The patent application highlights the reduction in size achieved by optimizing the layout of TSVs and signal bumps. However, it does not mention any potential limitations or constraints that may arise when implementing this technology in practical applications. Understanding any limitations could provide valuable insights for further development and optimization of integrated circuit devices.
Original Abstract Submitted
an integrated circuit device including a first semiconductor chip, a plurality of signal through silicon vias (tsv), a second semiconductor chip, a plurality of signal bumps and an interposer may be provided. the signal tsvs may be in the first semiconductor chip by a first pitch. the second semiconductor chip may be on the first semiconductor chip. the signal bumps may be on a lower surface of the second semiconductor chip by a second pitch wider than the first pitch. the interposer may be interposed between the first semiconductor chip and the second semiconductor chip and may be electrically connecting the signal tsvs with the signal bumps. thus, an occupying area of the signal tsvs in the first semiconductor chip may be decreased so that the integrated circuit device may have a smaller size.
