Samsung electronics co., ltd. (20240136237). TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD simplified abstract
Contents
- 1 TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
Organization Name
Inventor(s)
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136237 titled 'TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
Simplified Explanation
The abstract describes a substrate with multiple input/output regions, mounting regions, and pads connecting them.
- The substrate has a first input/output region with a first input pad and a first output pad.
- There are first positive and negative pads in a first mounting region connected to the first input and output pads.
- A second mounting region contains second positive and negative pads.
- A second input/output region includes a second input pad connected to the fourth positive pad and a second output pad connected to the fourth negative pad.
Potential Applications
This technology could be used in electronic circuit design, power distribution systems, and signal processing applications.
Problems Solved
This technology simplifies the connection and mounting of electronic components, reducing the complexity of circuit design and assembly processes.
Benefits
The substrate design allows for efficient routing of signals, improved electrical connectivity, and enhanced reliability in electronic systems.
Potential Commercial Applications
"Enhancing Electronic Connectivity and Reliability in Circuit Design"
Possible Prior Art
There may be prior art related to multi-pad substrates for electronic components, but specific examples are not provided in the abstract.
Unanswered Questions
How does this substrate design compare to existing technologies in terms of cost-effectiveness?
The abstract does not mention cost implications of implementing this technology compared to traditional methods.
What are the potential limitations or drawbacks of using this substrate in electronic systems?
The abstract does not address any potential challenges or limitations that may arise when integrating this substrate into practical applications.
Original Abstract Submitted
a substrate includes a first input/output region; a first input pad provided in the first input/output region; a first output pad provided in the first input/output region; a first mounting region; a first positive pad provided in the first mounting region and connected to the first input pad; a first negative pad provided in the first mounting region connected to the first output pad; a second positive pad provided in the first mounting region; a second negative pad provided in the first mounting region; a second mounting region; a third positive pad provided in the second mounting region and connected to the second positive pad; a third negative pad provided in the second mounting region and connected to the second negative pad; a fourth positive pad provided in the second mounting region; a fourth negative pad provided in the second mounting region; a second input/output region; a second input pad provided in the second input/output region and connected to the fourth positive pad; and a second output pad provided in the second input/output region and connected to the fourth negative pad.
