Samsung electronics co., ltd. (20240136216). WAFER PROCESSING APPARATUS simplified abstract
Contents
- 1 WAFER PROCESSING APPARATUS
WAFER PROCESSING APPARATUS
Organization Name
Inventor(s)
Youngho Hwang of Suwon-si (KR)
WAFER PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136216 titled 'WAFER PROCESSING APPARATUS
Simplified Explanation
The wafer processing apparatus described in the abstract includes a plate with support pins and vacuum ports, a heater, a flow regulator, and a chuck controller. The chuck controller adjusts the flow rate of fluid flowing into the vacuum ports to fix the wafer in place during heating.
- Plate with support pins and vacuum ports
- Heater for heating the plate
- Flow regulator for adjusting fluid flow into vacuum ports
- Chuck controller for controlling fluid flow during heating process
Potential Applications
The technology can be used in semiconductor manufacturing processes where precise control of wafer positioning and heating is required.
Problems Solved
This technology solves the problem of maintaining proper wafer positioning and temperature control during processing, which is crucial for high-quality semiconductor manufacturing.
Benefits
- Improved wafer processing accuracy - Enhanced control over wafer heating - Increased efficiency in semiconductor manufacturing processes
Potential Commercial Applications
"Advanced Wafer Processing Technology for Semiconductor Manufacturing"
Possible Prior Art
Prior art may include similar wafer processing apparatus with support pins and vacuum ports, but without the specific flow control features described in this patent application.
Unanswered Questions
How does this technology compare to existing wafer processing methods?
This technology offers more precise control over wafer positioning and heating compared to traditional methods. It allows for better quality control and efficiency in semiconductor manufacturing processes.
What are the potential cost implications of implementing this technology in semiconductor manufacturing facilities?
The cost implications of implementing this technology may include initial investment in the equipment and training for personnel. However, the increased efficiency and quality control it offers may result in long-term cost savings for semiconductor manufacturers.
Original Abstract Submitted
provided is a wafer processing apparatus including a plate having a plurality of support pins configured such that a wafer is mounted on the plurality of support pins and a plurality of vacuum ports positioned between the plurality of support pins, a heater configured to heat the plate, a flow regulator configured to provide a vacuum pressure for fixing the wafer to the plurality of vacuum ports, and configured to adjust a flow rate of a fluid flowing into the plurality of vacuum ports to be a target flow rate, and a chuck controller configured to control the target flow of the fluid set in the flow regulator, wherein the chuck controller is configured to generate a flow control signal for reducing the target flow rate of the fluid and send the flow control signal to the flow regulator during a heating process of the wafer.
