Samsung electronics co., ltd. (20240133919). METHOD OF REMOVING AND COLLECTING PARTICLES FROM PHOTOMASK AND DEVICE FOR REMOVING AND COLLECTING PARTICLES THEREFROM simplified abstract

From WikiPatents
Revision as of 02:24, 26 April 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

METHOD OF REMOVING AND COLLECTING PARTICLES FROM PHOTOMASK AND DEVICE FOR REMOVING AND COLLECTING PARTICLES THEREFROM

Organization Name

samsung electronics co., ltd.

Inventor(s)

Gyubaek Lee of Suwon-si (KR)

METHOD OF REMOVING AND COLLECTING PARTICLES FROM PHOTOMASK AND DEVICE FOR REMOVING AND COLLECTING PARTICLES THEREFROM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240133919 titled 'METHOD OF REMOVING AND COLLECTING PARTICLES FROM PHOTOMASK AND DEVICE FOR REMOVING AND COLLECTING PARTICLES THEREFROM

Simplified Explanation

The inventive concept provides a method of removing and collecting particles from a photomask including fabricating the photomask on a substrate, generating a first map indicating locations of particles on a surface of the photomask by inspecting the surface of the photomask using a probe tip, vertically moving the probe tip to a first vertical height that is lower than a height of the particle, horizontally moving the probe tip parallel to the surface of the photomask at the first vertical height, generating a second map indicating locations of particles on the surface of the photomask using the probe tip, vertically moving the probe tip to a second vertical height that is lower than the first vertical height, and horizontally moving the probe tip parallel to the surface of the photomask at the second vertical height.

  • Method of removing and collecting particles from a photomask
  • Fabricating the photomask on a substrate
  • Generating maps indicating locations of particles on the photomask surface
  • Using a probe tip to inspect and move vertically and horizontally
  • Efficient process for particle removal and collection

Potential Applications

The technology can be applied in the semiconductor industry for improving the quality of photomasks used in manufacturing processes.

Problems Solved

1. Contamination of photomasks by particles 2. Ensuring high precision in semiconductor manufacturing

Benefits

1. Enhanced quality of photomasks 2. Increased efficiency in particle removal 3. Improved accuracy in semiconductor production

Potential Commercial Applications

Optimizing photomask fabrication processes in semiconductor manufacturing.

Possible Prior Art

There may be existing methods for particle removal from photomasks using different techniques, but the specific approach outlined in this patent application may be novel.

Unanswered Questions

How does this method compare to traditional particle removal techniques in terms of efficiency and effectiveness?

The article does not provide a direct comparison between this method and traditional techniques, leaving room for further analysis on the advantages and disadvantages of each approach.

What are the potential limitations or challenges in implementing this technology on an industrial scale?

The article does not address the scalability or practicality of implementing this technology in large-scale semiconductor manufacturing operations, raising questions about its feasibility in real-world applications.


Original Abstract Submitted

the inventive concept provides a method of removing and collecting particles from a photomask including fabricating the photomask on a substrate, generating a first map indicating locations of particles on a surface of the photomask by inspecting the surface of the photomask using a probe tip, vertically moving the probe tip to a first vertical height that is lower than a height of the particle, horizontally moving the probe tip parallel to the surface of the photomask at the first vertical height, generating a second map indicating locations of particles on the surface of the photomask using the probe tip, vertically moving the probe tip to a second vertical height that is lower than the first vertical height, and horizontally moving the probe tip parallel to the surface of the photomask at the second vertical height.