Samsung electronics co., ltd. (20240136266). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136266 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a complex structure involving multiple redistribution layers and bonding pads, as well as a bonding wire and a molding layer for protection.
- The semiconductor package consists of a first redistribution structure with a first redistribution layer and bonding pad, a first semiconductor chip, a second redistribution structure with a second redistribution layer and bonding pad, and a bonding wire connecting the two bonding pads.
- The package is covered by a molding layer that protects the components within.
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and efficient semiconductor packaging.
Problems Solved
This technology solves the problem of efficiently connecting multiple semiconductor chips within a small package while ensuring proper electrical connections and protection from external elements.
Benefits
The benefits of this technology include improved performance, increased reliability, and reduced size of electronic devices due to the compact and efficient semiconductor packaging.
Potential Commercial Applications
The semiconductor package described in this patent application could find commercial applications in the semiconductor industry for manufacturing advanced electronic devices with higher performance and reliability.
Possible Prior Art
One possible prior art for this technology could be the use of multi-layer redistribution structures in semiconductor packaging to improve electrical connections and compactness.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing semiconductor packaging solutions.
What are the environmental implications of using this technology in electronic devices?
The article does not address the environmental implications of using this technology in electronic devices.
Original Abstract Submitted
a semiconductor package includes a first redistribution structure including a first redistribution layer and a first redistribution bonding pad, the first redistribution bonding pad electrically connected to the first redistribution layer, a first semiconductor chip on the first redistribution structure, and a second redistribution structure on the first semiconductor chip, the second redistribution structure including a second redistribution layer and a second redistribution bonding pad, the second redistribution layer electrically connected to the second redistribution layer. the semiconductor package includes a bonding wire electrically connecting the second redistribution bonding pad and the first redistribution bonding pad to each other, and a molding layer covering at least a portion the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.
