Samsung electronics co., ltd. (20240128234). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128234 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application involves semiconductor structures stacked in a stepwise manner, with each structure consisting of a lower structure, an upper structure, and an insulating layer on the bottom surface of the upper structure. The insulating layer contacts at least a portion of the side surfaces of the lower structure, and the area of the lower structure may be smaller than the area of the upper structure when viewed in a plan view. The side surface of the insulating layer is vertically aligned with the side surface of the upper structure.
- Semiconductor package with stacked structures
- Lower structure, upper structure, and insulating layer
- Insulating layer in contact with side surfaces of lower structure
- Area of lower structure smaller than upper structure
- Vertical alignment of insulating layer with upper structure
Potential Applications
The technology described in this patent application could be applied in:
- Semiconductor manufacturing
- Integrated circuits
- Electronics industry
Problems Solved
This technology helps to:
- Improve thermal management
- Increase efficiency of semiconductor devices
- Enhance overall performance
Benefits
The benefits of this technology include:
- Better heat dissipation
- Higher reliability
- Compact design
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive industry
- Telecommunications sector
Possible Prior Art
One possible prior art related to this technology is the use of insulating layers in semiconductor packaging to improve thermal performance and reliability.
What materials are used in the insulating layer of the semiconductor package?
The materials used in the insulating layer of the semiconductor package are not specified in the abstract. Further details may be provided in the full patent application.
How does the vertical alignment of the insulating layer with the upper structure benefit the overall design of the semiconductor package?
The vertical alignment of the insulating layer with the upper structure helps to improve the structural integrity and thermal conductivity of the semiconductor package. This alignment ensures efficient heat dissipation and enhances the overall performance of the device.
Original Abstract Submitted
a semiconductor package includes semiconductor structures stacked in a stepwise manner. each of the semiconductor structures may include a lower structure, an upper structure on the lower structure, and an insulating layer provided on a bottom surface of the upper structure to be in contact with at least a portion of side surfaces of the lower structure. an area of the lower structure may be smaller than an area of the upper structure, when viewed in a plan view, and a side surface of the insulating layer may be vertically aligned to a side surface of the upper structure.
