Samsung electronics co., ltd. (20240128229). SOLDER REFLOW APPARATUS simplified abstract
Contents
- 1 SOLDER REFLOW APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOLDER REFLOW APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SOLDER REFLOW APPARATUS
Organization Name
Inventor(s)
Byungkeun Kang of Suwon-si (KR)
SOLDER REFLOW APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128229 titled 'SOLDER REFLOW APPARATUS
Simplified Explanation
A solder reflow apparatus includes a reflow chamber, a heater, and a stage. The reflow chamber receives a heat transfer fluid to transfer heat to solder for mounting electronic parts on a substrate. The heater heats the heat transfer fluid, and the stage supports the substrate, inclined to induce the heat transfer fluid towards the central and edge portions of the substrate for uniform soldering.
- Reflow chamber for heat transfer fluid
- Heater to heat the fluid
- Stage supporting substrate, inclined for uniform heat distribution
Potential Applications
The solder reflow apparatus can be used in electronics manufacturing for soldering electronic components onto substrates.
Problems Solved
Ensures uniform soldering of electronic parts on substrates by distributing heat transfer fluid evenly across the central and edge portions.
Benefits
- Improved soldering quality - Increased efficiency in electronics manufacturing - Consistent results in soldering processes
Potential Commercial Applications
"Enhancing Soldering Processes in Electronics Manufacturing"
Possible Prior Art
Prior art may include traditional soldering methods using ovens or hot plates for solder reflow processes.
Unanswered Questions
How does the apparatus handle different types of solder and substrates?
The article does not specify if the apparatus is adaptable to various solder types and substrate materials.
What is the maintenance required for the solder reflow apparatus?
The article does not mention the maintenance schedule or procedures for the solder reflow apparatus.
Original Abstract Submitted
a solder reflow apparatus may include a reflow chamber, a heater and a stage. the reflow chamber may be configured to receive a heat transfer fluid. the heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. the heater may be configured to heat the heat transfer fluid in the reflow chamber. the stage may be in the reflow chamber to support the substrate. the stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.
