Samsung electronics co., ltd. (20240128221). SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES
Organization Name
Inventor(s)
Sangsick Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128221 titled 'SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATION DISTANCES
Simplified Explanation
The semiconductor package described in the abstract includes a substrate with lower pads, bumps attached to the lower pads, and non-conductive films on the substrate surface. The package is divided into regions based on the separation distance between the bumps, with a constant sum of thicknesses of the non-conductive films.
- Lower pads on the substrate surface
- Bumps attached to the lower pads
- Non-conductive films on the substrate surface
- Division of the package into regions based on bump separation distance
- Constant sum of non-conductive film thicknesses
Potential Applications
The technology described in this semiconductor package could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in improving the reliability and performance of semiconductor packages by ensuring a consistent sum of non-conductive film thicknesses and defining regions based on bump separation distance.
Benefits
The benefits of this technology include enhanced durability, improved electrical performance, and better thermal management in semiconductor packages.
Potential Commercial Applications
The semiconductor package technology could be utilized in the manufacturing of advanced electronic devices, leading to more reliable and efficient products in the market.
Possible Prior Art
One possible prior art in semiconductor packaging technology is the use of redistribution layers (RDL) to enhance the electrical connections in integrated circuits.
Unanswered Questions
How does the separation distance between bumps affect the overall performance of the semiconductor package?
The abstract mentions that regions are defined based on the separation distance between bumps, but it does not elaborate on the specific impact of this parameter on the package's functionality.
What are the specific materials used for the non-conductive films in the semiconductor package?
While the abstract mentions the presence of non-conductive films, it does not provide details on the materials used for these films, which could be crucial for understanding the package's properties.
Original Abstract Submitted
according to embodiments of the present disclosure, a semiconductor package is provided. the semiconductor package includes a substrate including a first surface and a second surface opposite to the first surface; and a plurality of lower pads on the second surface at different intervals. the semiconductor package further includes: a plurality of bumps attached to the plurality of lower pads; a first non-conductive film on the second surface of the substrate; and a second non-conductive film on the first non-conductive film. a plurality of regions are defined in the semiconductor package according to a separation distance between the plurality of bumps, such that each region of the plurality of regions includes respective bumps, from among the plurality of bumps, that have a respective separation distance between neighboring ones of the respective bumps within the region. a sum of thicknesses of the first and second non-conductive films is constant.
