Samsung electronics co., ltd. (20240128104). LOAD PORT MODULE AND DRIVING METHOD THEREOF simplified abstract

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LOAD PORT MODULE AND DRIVING METHOD THEREOF

Organization Name

samsung electronics co., ltd.

Inventor(s)

Sang Lyong Shin of Suwon-si (KR)

LOAD PORT MODULE AND DRIVING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128104 titled 'LOAD PORT MODULE AND DRIVING METHOD THEREOF

Simplified Explanation

The patent application describes a load port module that includes a mounting table for receiving a container, a door opener for opening and closing the container door, an image generator for capturing images of the substrate inside the container at different angles, and a controller for analyzing the images to determine warpage and alignment of the substrate.

  • Mounting table for receiving a container
  • Door opener for opening and closing the container door
  • Image generator for capturing images of the substrate at different angles
  • Controller for analyzing images to determine warpage and alignment of the substrate

Potential Applications

The technology could be applied in semiconductor manufacturing, where precise alignment and flatness of substrates are critical for the production of high-quality chips.

Problems Solved

This technology solves the problem of accurately assessing the warpage and alignment of substrates inside containers, which is essential for ensuring the quality of semiconductor manufacturing processes.

Benefits

The benefits of this technology include improved quality control, increased production efficiency, and reduced waste in semiconductor manufacturing operations.

Potential Commercial Applications

"Advanced Substrate Analysis Technology for Semiconductor Manufacturing"

Possible Prior Art

There may be prior art related to image analysis systems used in semiconductor manufacturing for substrate inspection and quality control.

Unanswered Questions

How does this technology compare to existing methods for substrate analysis in semiconductor manufacturing?

This article does not provide a direct comparison between this technology and existing methods for substrate analysis in semiconductor manufacturing.

What are the potential cost implications of implementing this technology in semiconductor manufacturing facilities?

This article does not address the potential cost implications of implementing this technology in semiconductor manufacturing facilities.


Original Abstract Submitted

a load port module includes: a mounting table configured to receive a container, wherein the container is configured to receive a substrate therein; a door opener is configured to open and close a door of the container; an image generator is on the door opener, and the image generator is configured to generate a first image of the substrate at a first angle with respect to the substrate, and a second image of the substrate at a second angle with respect to the substrate different from the first angle; and a controller is configured to determine warpage of the substrate based on the first image and to determine alignment of the substrate based on the second image.