Samsung electronics co., ltd. (20240120319). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyunsoo Chung of Suwon-si (KR)
Younglyong Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120319 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract consists of multiple semiconductor structures bonded together, each including semiconductor layers with active surfaces and circuit devices.
- The first semiconductor structure has a first semiconductor layer with a circuit device on the first active surface and a bonding layer on the first inactive surface.
- The second semiconductor structure is on top of the first and includes a second semiconductor layer with a circuit device on the second active surface, frontside and backside bonding layers on the second inactive surface.
- The third semiconductor structure is on top of the second and includes a third semiconductor layer with a circuit device on the third active surface and a bonding layer.
- Potential Applications:**
- Advanced semiconductor packaging technology for high-performance electronic devices. - Integration of multiple circuit devices in a compact package for improved functionality.
- Problems Solved:**
- Enhanced performance and functionality of semiconductor devices through multi-layer integration. - Improved thermal management and electrical connectivity in semiconductor packages.
- Benefits:**
- Increased circuit density and functionality in a compact package. - Enhanced thermal dissipation and reliability of semiconductor devices.
- Potential Commercial Applications:**
- High-performance computing systems. - Automotive electronics. - Telecommunications equipment.
- Possible Prior Art:**
There may be prior art related to multi-layer semiconductor packaging techniques, such as stacked die packages or system-in-package technologies.
- Unanswered Questions:**
1. How does the bonding process between the different semiconductor structures affect the overall performance and reliability of the package? 2. What specific materials are used for the bonding layers in this semiconductor package, and how do they contribute to the overall functionality of the device?
Original Abstract Submitted
a semiconductor package includes a first semiconductor structure including a first semiconductor layer having a first active surface and a first circuit device thereon and a first inactive surface and first bonding layer; a second semiconductor structure on the first semiconductor structure and including a second semiconductor layer having a second active surface and second circuit device thereon and a second inactive surface, a second frontside bonding layer, and a second backside bonding layer on the second inactive surface; and a third semiconductor structure on the second semiconductor structure and including a third semiconductor layer having a third active surface including a third circuit device thereon and a third inactive surface, and a third bonding layer, wherein the first bonding layer is bonded to the second frontside bonding layer, and the third bonding layer is bonded to the second backside bonding layer.
