Samsung electronics co., ltd. (20240120310). SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME simplified abstract
Contents
- 1 SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
Organization Name
Inventor(s)
SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120310 titled 'SOLDER REFLOW SYSTEM AND SOLDER REFLOW METHOD USING THE SAME
Simplified Explanation
The patent application describes a solder reflow system that includes a solder reflow apparatus, a condensation apparatus, and a cleaning apparatus. The system is designed to reflow solder on a semiconductor package, condensate gas generated during the process, and clean the package using a cleaning agent.
- Solder reflow apparatus: Reflows solder on a semiconductor package using a heat transfer fluid.
- Condensation apparatus: Receives the processed semiconductor package and condensates gas generated from the heat transfer fluid into a liquid.
- Cleaning apparatus: Cleans the semiconductor package using a cleaning agent, removing any heat transfer fluid stains.
Potential Applications
The technology can be applied in semiconductor manufacturing processes to ensure the cleanliness and integrity of semiconductor packages.
Problems Solved
1. Prevents contamination of the cleaning agent with heat transfer fluid. 2. Ensures efficient cleaning of semiconductor packages without residue.
Benefits
1. Maintains the cleaning capacity of the cleaning agent. 2. Improves the overall quality of semiconductor packages.
Potential Commercial Applications
"Semiconductor Package Cleaning System: Enhancing Manufacturing Efficiency and Quality"
Possible Prior Art
There are existing solder reflow systems in semiconductor manufacturing, but the specific combination of a condensation apparatus and cleaning apparatus in this system may be novel.
Unanswered Questions
How does the system handle different sizes of semiconductor packages during the cleaning process?
The patent application does not provide details on how the system accommodates various sizes of semiconductor packages for cleaning.
What is the expected maintenance schedule for the solder reflow system to ensure optimal performance?
The patent application does not mention the recommended maintenance schedule for the solder reflow system to maintain its efficiency and effectiveness.
Original Abstract Submitted
a solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. the solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. the condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. the condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. the cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. as a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.
