Samsung electronics co., ltd. (20240120263). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
HWANYOUNG Choi of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120263 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate, an interposer mounted on the package substrate via first conductive bumps, first and second semiconductor devices on the interposer with concavo-convex patterns on their upper surfaces, and a sealing member covering the semiconductor devices and exposing the concavo-convex patterns.
- The first semiconductor device has a plurality of first pillar structures in a first region with a certain width, and a plurality of second pillar structures in a second region with a greater width.
- The concavo-convex patterns on the semiconductor devices help improve thermal dissipation and mechanical stability of the package.
Potential Applications
This technology could be applied in high-performance computing, data centers, telecommunications, and automotive electronics.
Problems Solved
This technology helps address issues related to thermal management and mechanical stress in semiconductor packages.
Benefits
The concavo-convex patterns improve heat dissipation, enhance mechanical stability, and potentially increase the overall reliability of the semiconductor package.
Potential Commercial Applications
Potential commercial applications of this technology include advanced microprocessors, graphics processing units, and power management integrated circuits.
Possible Prior Art
One possible prior art could be the use of heat sinks or thermal interface materials to improve thermal management in semiconductor packages.
Unanswered Questions
How does the concavo-convex pattern affect the electrical performance of the semiconductor devices?
The abstract does not provide information on how the concavo-convex pattern may impact the electrical characteristics of the semiconductor devices. Further research or experimentation may be needed to understand this aspect.
Are there any specific manufacturing processes required to create the concavo-convex patterns on the semiconductor devices?
The abstract does not mention the specific manufacturing techniques or processes used to form the concavo-convex patterns on the semiconductor devices. Understanding the fabrication methods could be crucial for implementing this technology in practical applications.
Original Abstract Submitted
a semiconductor package includes a package substrate, an interposer mounted on the package substrate via first conductive bumps; first and second semiconductor devices on the interposer and spaced apart from each other, mounted on the interposer via second conductive bumps and having concavo-convex patterns respectively formed in upper surfaces thereof; and a sealing member on the interposer covering the first and second semiconductor devices and exposing the concavo-convex patterns. the concavo-convex pattern of the first semiconductor device includes a plurality of first pillar structures provided in the upper surface of a first region of the first semiconductor device and having a first width, and a plurality of second pillar structures provided in the upper surface of a second region of the first semiconductor device and having a second width greater than the first width.
