Samsung electronics co., ltd. (20240114662). ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE simplified abstract
Contents
- 1 ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this technology compare to existing heat dissipation methods in terms of efficiency and cost-effectiveness?
- 1.9.3 What specific materials are used in the thermal interface material and adhesive member, and how do they contribute to the overall performance of the electronic device?
- 1.10 Original Abstract Submitted
ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE
Organization Name
Inventor(s)
Youngwook Kim of Suwon-si (KR)
Jonggeun Yoon of Suwon-si (KR)
ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114662 titled 'ELECTRONIC DEVICE COMPRISING HEAT EMISSION STRUCTURE
Simplified Explanation
The electronic device described in the patent application includes a heat generation source with a heat dissipation surface, a support member surrounding the heat generation source, a heat dissipation member covering the support member, a thermal interface material between the heat generation surface and the heat dissipation member, and an adhesive member coupling the thermal interface material and the heat dissipation member.
- Heat generation source with heat dissipation surface
- Support member surrounding heat generation source
- Heat dissipation member covering support member
- Thermal interface material between heat generation surface and heat dissipation member
- Adhesive member coupling thermal interface material and heat dissipation member
Potential Applications
This technology could be applied in electronic devices such as computers, smartphones, and other devices that require efficient heat dissipation to prevent overheating.
Problems Solved
This technology solves the problem of heat buildup in electronic devices, which can lead to decreased performance and potential damage to components.
Benefits
The benefits of this technology include improved heat dissipation, increased device performance, and extended lifespan of electronic devices.
Potential Commercial Applications
Potential commercial applications of this technology include consumer electronics, industrial equipment, and automotive systems where efficient heat dissipation is crucial for optimal performance.
Possible Prior Art
One possible prior art for this technology could be similar heat dissipation solutions used in electronic devices such as laptops and desktop computers.
Unanswered Questions
How does this technology compare to existing heat dissipation methods in terms of efficiency and cost-effectiveness?
This article does not provide a direct comparison between this technology and existing heat dissipation methods, leaving the reader to wonder about the relative advantages and disadvantages of each approach.
What specific materials are used in the thermal interface material and adhesive member, and how do they contribute to the overall performance of the electronic device?
The article does not delve into the specific materials used in the thermal interface material and adhesive member, leaving a gap in understanding how these components function within the device.
Original Abstract Submitted
an electronic device is provided. the electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.
