Samsung electronics co., ltd. (20240113067). SOLDER REFLOW APPARATUS simplified abstract
Contents
- 1 SOLDER REFLOW APPARATUS
SOLDER REFLOW APPARATUS
Organization Name
Inventor(s)
SOLDER REFLOW APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113067 titled 'SOLDER REFLOW APPARATUS
Simplified Explanation
The abstract describes a solder reflow apparatus that includes a reflow chamber, a heater, a stage, and a jig for mounting electronic parts on a substrate by transferring heat to the solder.
- Reflow chamber designed to hold heat transfer fluid for solder mounting.
- Heater heats the heat transfer fluid in the reflow chamber.
- Stage supports the substrate within the reflow chamber.
- Jig fixes the electronic part in place during soldering.
Potential Applications
The technology can be applied in the electronics manufacturing industry for soldering electronic components onto substrates.
Problems Solved
1. Ensures proper and efficient soldering of electronic parts onto substrates. 2. Provides a controlled environment for the solder reflow process.
Benefits
1. Improved soldering quality and reliability. 2. Increased efficiency in electronic assembly processes. 3. Consistent and precise soldering results.
Potential Commercial Applications
Optimizing Solder Reflow Apparatus for Electronic Manufacturing Processes
Possible Prior Art
Prior art may include traditional soldering methods using soldering irons or ovens for electronic component mounting.
Unanswered Questions
How does the reflow chamber maintain a consistent temperature during the soldering process?
The reflow chamber likely utilizes a feedback control system to monitor and adjust the temperature of the heat transfer fluid to maintain consistency.
What types of electronic parts and substrates are compatible with this solder reflow apparatus?
The apparatus can be used with a variety of electronic components and substrates, as long as they can withstand the heat transfer fluid and temperature required for soldering.
Original Abstract Submitted
a solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.
