Samsung electronics co., ltd. (20240113057). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
YEONGSEON Kim of SUWON-SI (KR)
SUNKYOUNG Seo of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113057 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application involves stacking two semiconductor chips, each with a substrate, insulating layer, and exposed pad. The pads on each chip have inclined side surfaces and widths that increase towards their respective substrates.
- The semiconductor package includes a first semiconductor chip stacked on a second semiconductor chip.
- The first semiconductor chip has a first substrate, a first insulating layer, and a first pad exposed through the insulating layer.
- The second semiconductor chip has a second substrate, a second insulating layer contacting the first insulating layer, and a second pad exposed through the second insulating layer.
- The first pad has an inclined side surface and a width that increases towards the first substrate.
- The second pad has an inclined side surface and a width that increases towards the second substrate.
Potential Applications
This technology could be applied in:
- Advanced semiconductor packaging
- High-density integrated circuits
- Miniaturized electronic devices
Problems Solved
This technology addresses issues related to:
- Improving signal transmission between stacked semiconductor chips
- Enhancing thermal management in compact electronic devices
Benefits
The benefits of this technology include:
- Increased efficiency in data transfer
- Enhanced reliability in semiconductor packaging
- Improved performance in miniaturized electronic devices
Potential Commercial Applications
Potential commercial applications of this technology could include:
- Mobile devices
- Wearable technology
- Internet of Things (IoT) devices
Possible Prior Art
One possible prior art in semiconductor packaging is the use of through-silicon vias (TSVs) to connect stacked chips. Another could be the use of microbumps for interconnection in 3D integrated circuits.
Unanswered Questions
How does this technology impact overall system performance?
The article does not delve into the specific effects of this technology on the overall performance of electronic systems. Further research may be needed to understand the full implications.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential obstacles or difficulties that may arise when scaling up the production and implementation of this technology. Investigating this aspect further could provide valuable insights for industry professionals.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip stacked on a second semiconductor chip. the first semiconductor chip includes a first substrate, a first insulating layer on a lower surface of the first substrate, and a first pad exposed through the first insulating layer. the second semiconductor chip includes a second substrate, a second insulating layer on an upper surface of the second substrate contacting the first insulating layer, and a second pad exposed through the second insulating layer contacting the first pad. the first pad has an inclined side surface and a first width that increases toward the first substrate, and the second pad has an inclined side surface and a second width that increases toward the second substrate.
