Samsung electronics co., ltd. (20240112974). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240112974 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a complex structure involving multiple layers and components to enhance the performance and reliability of the semiconductor chip.
- First redistribution structure with a redistribution layer
- First semiconductor chip positioned on the redistribution structure
- Insulating layer adjacent to the sidewall of the semiconductor chip
- Connection structure extending through the insulating layer
- First molding layer covering the semiconductor chip
- Second molding layer on top of the insulating layer and first molding layer
- Potential Applications**
This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require high-performance semiconductor chips.
- Problems Solved**
This technology helps in improving the electrical connections, thermal management, and overall reliability of semiconductor packages, addressing issues related to signal integrity, power efficiency, and heat dissipation.
- Benefits**
The benefits of this technology include enhanced performance, increased reliability, improved thermal management, and compact design of semiconductor packages.
- Potential Commercial Applications**
This technology can be utilized in the semiconductor industry for manufacturing advanced packaging solutions for a wide range of electronic devices, catering to the growing demand for high-performance and reliable semiconductor chips.
- Possible Prior Art**
One possible prior art in semiconductor packaging technology is the use of multi-layer structures and molding layers to protect and enhance the performance of semiconductor chips.
- Unanswered Questions**
- What specific materials are used in the first and second molding layers?
- How does the connection structure improve the electrical connectivity of the semiconductor chip?
Original Abstract Submitted
a semiconductor package includes a first redistribution structure including a first redistribution layer, a first semiconductor chip on the first redistribution structure, an insulating layer adjacent a sidewall of the first semiconductor chip on the first redistribution structure and spaced apart from the first semiconductor chip in a horizontal direction, a connection structure extending through the insulating layer in a vertical direction and electrically connected to the first redistribution layer, a first molding layer on a sidewall and a top surface of the first semiconductor chip, and a second molding layer directly on each of a top surface of the insulating layer and a top surface of the first molding layer. the second molding layer includes a material different from a material of the first molding layer, and the top surface of the first semiconductor chip is lower than the top surface of the insulating layer.
