Samsung electronics co., ltd. (20240105650). SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS
Organization Name
Inventor(s)
Sungwook Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105650 titled 'SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS
Simplified Explanation
The semiconductor package described in the abstract includes a three-dimensional stacked structure with an upper second semiconductor chip stacked on a lower first semiconductor chip. The power distribution networks for each chip are implemented through circuits of the first semiconductor chip and are separated from the first chip.
- Power distribution networks for first and second semiconductor chips are implemented through circuits of the first semiconductor chip.
- The power distribution networks are separated from the first semiconductor chip.
Potential Applications
This technology could be applied in:
- High-performance computing systems
- Mobile devices
- Internet of Things (IoT) devices
Problems Solved
This technology helps in:
- Improving power distribution efficiency
- Reducing heat generation
- Increasing overall performance of semiconductor packages
Benefits
The benefits of this technology include:
- Enhanced power distribution efficiency
- Improved performance of semiconductor chips
- Reduction in heat dissipation
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive industry
- Aerospace industry
Possible Prior Art
One possible prior art for this technology could be:
- Stacked semiconductor packages with integrated power distribution networks
Unanswered Questions
How does this technology impact the overall cost of semiconductor packages?
The article does not provide information on the cost implications of implementing this technology. It would be helpful to understand if the benefits outweigh the potential increase in cost.
What are the environmental implications of using this technology?
The environmental impact of manufacturing and disposing of semiconductor packages with this technology is not addressed in the article. It would be important to consider the sustainability aspect of this innovation.
Original Abstract Submitted
provided is a semiconductor package including a three-dimensional (3d) stacked structure in which an upper second semiconductor chip is stacked on a lower first semiconductor chip. in the semiconductor package, a power distribution network for the first semiconductor chip and a power distribution network for the second semiconductor chip are implemented through circuits of the first semiconductor chip and separated from the first semiconductor chip.
