Samsung electronics co., ltd. (20240105636). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kanggyune Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105636 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a package substrate, a semiconductor chip, a sealing layer, and a marking pattern on the sealing layer.
- The package substrate provides a base for the semiconductor chip and other components.
- The sealing layer covers the semiconductor chip and includes a marking pattern for identification purposes.
Potential Applications
This technology could be used in various electronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology helps in identifying and tracking semiconductor chips within electronic devices.
Benefits
The marking pattern on the sealing layer allows for easy identification and tracking of semiconductor chips during manufacturing and assembly processes.
Potential Commercial Applications
- "Semiconductor Package with Marking Pattern for Identification and Tracking"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques and methods for marking semiconductor chips for identification purposes.
Unanswered Questions
How does the marking pattern on the sealing layer affect the overall performance of the semiconductor package?
The article does not delve into the specific impact of the marking pattern on the functionality or efficiency of the semiconductor package.
Are there any limitations to the use of marking patterns on sealing layers in semiconductor packaging?
The article does not address any potential drawbacks or constraints associated with incorporating marking patterns on sealing layers in semiconductor packaging.
Original Abstract Submitted
a semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, a sealing layer on the package substrate and at least partially covering the first semiconductor chip and including an upper surface, a first side surface, and a first inclined surface extending between the upper surface and the first side surface, and a first marking pattern in or on the first inclined surface of the sealing layer.
