Samsung electronics co., ltd. (20240105536). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Seokbong Park of Suwon-si (KR)
Unbyoung Kang of Suwon-si (KR)
Seunghun Chae of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105536 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes various layers and structures to protect and connect the semiconductor chip. Here are some key points to explain the patent/innovation:
- The package includes a first redistribution structure, a first semiconductor chip, a first molding layer, connection structures, a first insulating layer, and a second redistribution structure.
- The first molding layer has at least one lower recess in its top surface and is placed on the first semiconductor chip.
- Connection structures extend vertically and pass through the first molding layer.
- The first insulating layer is on the first molding layer and partially fills the lower recess of the first molding layer.
Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, and computers to improve the performance and reliability of semiconductor packages.
Problems Solved
This technology helps in protecting the semiconductor chip from external elements, enhancing the connectivity within the package, and improving the overall durability of the semiconductor package.
Benefits
The benefits of this technology include increased reliability, improved performance, enhanced durability, and better protection for the semiconductor chip.
Potential Commercial Applications
Potential commercial applications of this technology could be in the semiconductor industry, electronics manufacturing, and consumer electronics market under the title "Innovative Semiconductor Packaging Technology for Enhanced Performance".
Possible Prior Art
One possible prior art could be the use of similar molding layers and redistribution structures in semiconductor packages to protect and connect semiconductor chips.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing solutions. Further research or analysis would be needed to determine the cost implications of implementing this innovation.
What are the environmental impacts of using this technology in semiconductor packaging?
The article does not address the environmental impacts of using this technology in semiconductor packaging. Understanding the environmental footprint of this innovation would require additional study and analysis.
Original Abstract Submitted
a semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure, a first molding layer on the first redistribution structure, the first molding layer including at least one lower recess in a top surface thereof and being disposed on the first semiconductor chip, connection structures on the first redistribution structure, the connection structures extending in a vertical direction and passing through the first molding layer, a first insulating layer on the first molding layer, and a second redistribution structure including a lower redistribution insulating layer on the first insulating layer, wherein the first insulating layer at least partially fills the at least one lower recess of the first molding layer.
