Samsung electronics co., ltd. (20240105470). SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
Organization Name
Inventor(s)
Sang-Woo Jang of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105470 titled 'SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
Simplified Explanation
The patent application describes a method for performing a plasma treatment process on a substrate using a substrate processing apparatus. The apparatus includes a housing, a power supply source, a shower head, an adapter, a lid, and pads made of polytetrafluoroethylene.
- The substrate processing apparatus includes a housing with a processing region, a power supply source for generating plasma, a shower head for supplying plasma to the processing region, an adapter connecting the power supply source and the shower head, a lid surrounding the adapter, and pads made of polytetrafluoroethylene between the shower head and the lid.
- The shower head has fastening holes, the lid is connected to the shower head through fastening portions inserted into the fastening holes, and the pads may contact the bottom surface of the adapter.
Potential Applications
The technology described in the patent application could be used in semiconductor manufacturing, surface treatment of materials, and thin film deposition processes.
Problems Solved
This technology solves the problem of efficiently and effectively performing plasma treatment processes on substrates while maintaining a stable and controlled environment within the processing apparatus.
Benefits
The benefits of this technology include improved process efficiency, enhanced substrate treatment quality, reduced maintenance requirements, and increased overall productivity in substrate processing operations.
Potential Commercial Applications
The technology could be applied in industries such as electronics manufacturing, solar panel production, and medical device fabrication.
Possible Prior Art
One possible prior art could be a similar substrate processing apparatus with different materials used for the pads or a different configuration of the adapter and lid.
Unanswered Questions
How does the use of polytetrafluoroethylene in the pads affect the overall performance of the substrate processing apparatus?
The use of polytetrafluoroethylene in the pads may provide benefits such as reduced friction, improved chemical resistance, and enhanced durability. However, the specific impact on the plasma treatment process and substrate quality needs further investigation.
What are the potential challenges in scaling up this technology for mass production in industrial settings?
Scaling up this technology for mass production may pose challenges such as ensuring uniformity in substrate treatment, optimizing process parameters for different substrates, and managing the overall cost-effectiveness of the system. Further research and development are needed to address these challenges.
Original Abstract Submitted
a method may include loading a substrate into a substrate processing apparatus and performing a plasma treatment process on the substrate. the substrate processing apparatus includes a housing that defines a processing region, a power supply source on the housing and configured to generate plasma, a shower head in the housing and configured to supply the plasma to the processing region, an adapter between the power supply source and the shower head and separated from the shower head, a lid surrounding at least part of the adapter, and pads between the shower head and the lid. the shower head may include first fastening holes. the lid may be connected to the shower head through fastening portions respectively inserted into the first fastening holes. the pads may include polytetrafluoroethylene. at least a part of the pads may contact a bottom surface of the adapter.
