Samsung electronics co., ltd. (20240105425). SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME simplified abstract
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME
Organization Name
Inventor(s)
Jeongyeon Lee of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105425 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE BY USING THE SAME
Simplified Explanation
The substrate processing apparatus described in the patent application includes a first chamber for accommodating a substrate and a second chamber with a heater for thermal treatment. The first chamber also contains a target assembly with a target for deposition, a first ion gun for irradiating an ion beam onto the target, and a second ion gun for irradiating a hydrogen ion beam towards the substrate.
- Target assembly with deposition material
- First ion gun for discharging deposition particles onto the substrate
- Second ion gun with plasma generator for hydrogen ion beam
- Thermal treatment capability in the second chamber
Potential Applications
The technology described in this patent application could be used in the manufacturing of semiconductors, solar cells, and other electronic devices that require precise deposition and thermal treatment processes.
Problems Solved
This technology solves the problem of efficiently depositing materials onto substrates and performing thermal treatment in a controlled environment, leading to improved quality and performance of the final products.
Benefits
The benefits of this technology include enhanced deposition control, uniformity of coating, and precise thermal treatment, resulting in higher efficiency and reliability of the manufactured products.
Potential Commercial Applications
- Semiconductor manufacturing equipment with improved deposition and thermal treatment capabilities
- Solar cell production machinery for enhanced efficiency and performance
Possible Prior Art
One possible prior art could be similar substrate processing apparatus used in the semiconductor industry for deposition and thermal treatment processes.
Unanswered Questions
How does the technology handle substrate size variations?
The patent application does not provide information on how the substrate processing apparatus accommodates different sizes of substrates for deposition and thermal treatment processes.
What is the energy consumption of the apparatus?
The energy efficiency and consumption details of the substrate processing apparatus are not discussed in the patent application.
Original Abstract Submitted
a substrate processing apparatus including a first chamber configured to accommodate a substrate therein and a second chamber including a heater provided in an internal space thereof, wherein the first chamber includes a target assembly configured to fix a target including a deposition material, a first ion gun configured to irradiate an ion beam onto the target to discharge deposition particles, which are ions of the deposition material, to the substrate, and a second ion gun configured to irradiate a hydrogen ion beam toward the substrate, the second ion gun includes a plasma generator configured to generate plasma, and a first grid electrode and a second grid electrode each configured to extract ions from the container, and the second chamber is configured to be provided with the substrate, on which the hydrogen ion beam has been irradiated, and perform thermal treatment on the substrate.
