Samsung electronics co., ltd. (20240100647). SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240100647 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The patent application describes a substrate processing apparatus that includes a substrate support portion with a transparent polishing pad and a light generator on the platen. The apparatus also includes a substrate holder and a slurry supply portion that supplies slurry containing a light-blocking material and abrasive particles activated by a photocatalyst.
- Substrate processing apparatus with transparent polishing pad and light generator on the platen
- Slurry supply portion with light-blocking material and abrasive particles activated by a photocatalyst
Potential Applications
The technology described in the patent application could be applied in semiconductor manufacturing processes, specifically in the polishing of semiconductor substrates.
Problems Solved
This technology solves the problem of controlling the polishing process of semiconductor substrates by using light-blocking materials and abrasive particles activated by a photocatalyst in the slurry.
Benefits
The benefits of this technology include improved polishing precision, enhanced substrate surface quality, and increased efficiency in semiconductor manufacturing processes.
Potential Commercial Applications
The technology could be commercially applied in the semiconductor industry for the production of high-quality semiconductor devices.
Possible Prior Art
One possible prior art could be the use of traditional polishing methods in semiconductor manufacturing processes, which may not offer the same level of precision and efficiency as the technology described in the patent application.
Unanswered Questions
== How does the light generator interact with the photocatalyst in the slurry to activate the abrasive particles? The interaction between the light generated by the light generator and the photocatalyst in the slurry to activate the abrasive particles is not clearly explained in the abstract. Further details on this process would provide a better understanding of the technology.
== What specific types of semiconductor substrates are compatible with this substrate processing apparatus? The abstract does not specify the types of semiconductor substrates that can be processed using this apparatus. Knowing the compatibility of different semiconductor materials with this technology would be valuable information for potential users.
Original Abstract Submitted
a substrate processing apparatus includes a substrate support portion including a platen and a transparent polishing pad on the platen, the platen comprising a light generator that generates light that passes through the transparent polishing pad and proceeds towards a semiconductor substrate on the substrate support portion, and the transparent polishing pad including a surface that contacts and polishes the semiconductor substrate. the substrate processing apparatus further includes: a substrate holder that fixes the semiconductor substrate such that the semiconductor substrate is in contact with the substrate support portion; and a slurry supply portion that supplies slurry between the semiconductor substrate and the transparent polishing pad. the slurry includes a light blocking material that blocks the light; and abrasive particles that are configured to be activated by accepting electrons generated, based on the light, by a photocatalyst within the slurry.
