Samsung electronics co., ltd. (20240100639). ELECTROSTATIC CHUCK simplified abstract
Contents
- 1 ELECTROSTATIC CHUCK
ELECTROSTATIC CHUCK
Organization Name
Inventor(s)
ELECTROSTATIC CHUCK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240100639 titled 'ELECTROSTATIC CHUCK
Simplified Explanation
An electrostatic chuck includes a cooling plate with a cooling flow path, an insulating plate, an upper plate fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening member is constrained in a specific direction.
- Cooling plate with cooling flow path
- Insulating plate
- Upper plate fixed to cooling plate
- Fastening member coupling cooling plate to upper plate
- Fastening member constrained in a specific direction
Potential Applications
The technology can be used in semiconductor manufacturing processes where precise control of wafer positioning and temperature is crucial.
Problems Solved
The electrostatic chuck helps in maintaining stable and controlled temperature conditions for wafers during processing, preventing overheating or temperature fluctuations that could damage the semiconductor materials.
Benefits
- Improved wafer positioning and stability - Enhanced temperature control during processing - Prevention of damage to semiconductor materials
Potential Commercial Applications
"Electrostatic Chuck Technology for Semiconductor Manufacturing Processes"
Possible Prior Art
There are existing electrostatic chuck technologies in the semiconductor industry that provide similar functionalities, but this specific design with a cooling plate and constrained fastening member may offer improved temperature control and stability.
Unanswered Questions
How does this technology compare to traditional chuck designs in terms of temperature control and stability?
This article does not provide a direct comparison between this technology and traditional chuck designs in terms of temperature control and stability. Further research or testing may be needed to determine the specific advantages of this design over traditional ones.
What are the potential limitations or drawbacks of this specific electrostatic chuck design?
The article does not address any potential limitations or drawbacks of this specific electrostatic chuck design. Additional information or studies may be required to identify any shortcomings or challenges associated with its implementation.
Original Abstract Submitted
an electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. the fastening member passes through the cooling plate and is coupled to a fastening portion provided on a lower surface of the upper plate. movement of the fastening member is constrained only in a first direction intersecting an upper surface of the upper plate.
