Samsung electronics co., ltd. (20240098163). FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR simplified abstract
Contents
- 1 FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR
Organization Name
Inventor(s)
Myunghoon Kwak of Suwon-si Gyeonggi-do (KR)
Bohyeon Kim of Suwon-si Gyeonggi-do (KR)
Hyoungtak Cho of Suwon-si (KR)
Junghyeob Lee of Suwon-si (KR)
FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240098163 titled 'FOLDABLE ELECTRONIC DEVICE INCLUDING SHAPE MEMORY ALLOY AND CONTROLLING METHOD THEREFOR
Simplified Explanation
The abstract describes an electronic device with a hinge mechanism that allows it to switch between a folded and unfolded state using shape memory alloy materials.
- The electronic device includes a first housing, a second housing, and a hinge device for folding and unfolding.
- A first alloy member made of shape memory alloy material is fixed to the housings and hinge device.
- A second alloy device, also made of shape memory alloy material, is fixed to the housings at a different position from the first alloy member.
- A driving circuit applies power to the alloy members to restore their shape.
Potential Applications
The technology described in this patent application could be applied in the development of foldable electronic devices such as smartphones, tablets, or laptops.
Problems Solved
This innovation solves the problem of creating durable and flexible electronic devices that can be easily folded and unfolded without damaging the internal components.
Benefits
The use of shape memory alloy materials allows for a more reliable and long-lasting hinge mechanism in electronic devices, enhancing their overall durability and usability.
Potential Commercial Applications
The technology could be utilized by electronic device manufacturers looking to create innovative and flexible products that cater to the growing demand for foldable gadgets in the market.
Possible Prior Art
One possible prior art example could be the use of shape memory alloys in medical devices for minimally invasive surgeries, where the materials are used to create self-expanding stents.
Unanswered Questions
How does the driving circuit precisely control the restoration of the alloy members' shape?
The abstract does not provide detailed information on the specific mechanisms or algorithms used by the driving circuit to apply power and restore the shape of the alloy members.
What are the potential limitations or drawbacks of using shape memory alloy materials in electronic devices?
The abstract does not address any potential challenges or limitations that may arise from incorporating shape memory alloy materials in electronic devices, such as cost, manufacturing complexity, or performance issues.
Original Abstract Submitted
an electronic device may include a first housing, a second housing, a hinge device configured to connect the first housing and the second housing so that the electronic device is switched from a folded state into an unfolded state, a first alloy member, at least a part of which is fixed to the first housing, the second housing, and the hinge device and which is made of a shape memory alloy material, a second alloy device, at least a part of which is fixed to the first housing and the second housing at a position different from the first alloy member and which is made of a shape memory alloy material, and a driving circuit configured to apply power to at least one of the first alloy member and the second alloy member so that at least one of the first alloy member and the second alloy member is restored. various other embodiments may be possible.
- Samsung electronics co., ltd.
- Baekeun Cho of Suwon-si (KR)
- Myunghoon Kwak of Suwon-si Gyeonggi-do (KR)
- Bohyeon Kim of Suwon-si Gyeonggi-do (KR)
- Moonsun Kim of Suwon-si (KR)
- Jookwan Lee of Suwon-si (KR)
- Hyoungtak Cho of Suwon-si (KR)
- Soyoung Lee of Suwon-si (KR)
- Yangwook Kim of Suwon-si (KR)
- Junghyeob Lee of Suwon-si (KR)
- H04M1/02