Samsung display co., ltd. (20240138236). ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
- 1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing display module designs in terms of cost-effectiveness and efficiency?
- 1.11 What are the environmental implications of using multiple layers and filling parts in electronic devices?
- 1.12 Original Abstract Submitted
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEONGGEUN Won of SUWON-SI (KR)
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138236 titled 'ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The abstract describes an electronic device with a display module that includes multiple layers and a filling part. The electronic device is positioned below the display module and overlaps a specific area. A module hole is defined in the display module to expose the base layer, and the filling part is in contact with the exposed base layer.
- The electronic device includes a display module with multiple layers such as a base layer, circuit element layer, display element layer, encapsulation layer, cover inorganic layer, cover organic layer, and anti-reflection layer.
- The filling part is configured to overlap a specific area and is in contact with the exposed base layer through a module hole in the display module.
Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, and laptops to enhance display performance and durability.
Problems Solved
This technology solves the problem of protecting and enhancing the display module of electronic devices by providing multiple layers and a filling part for improved functionality.
Benefits
The benefits of this technology include improved display quality, increased durability, and enhanced overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include consumer electronics, automotive displays, medical devices, and industrial equipment.
Possible Prior Art
One possible prior art could be the use of multiple layers in display modules to enhance performance and durability in electronic devices.
Unanswered Questions
How does this technology compare to existing display module designs in terms of cost-effectiveness and efficiency?
This article does not provide a direct comparison with existing display module designs in terms of cost-effectiveness and efficiency. Further research and analysis would be needed to determine the advantages and disadvantages of this technology in comparison to others.
What are the environmental implications of using multiple layers and filling parts in electronic devices?
The article does not address the environmental implications of using multiple layers and filling parts in electronic devices. It would be important to consider the impact on recycling, waste management, and sustainability in the production and disposal of devices incorporating this technology.
Original Abstract Submitted
an electronic device includes a display device and an electronic device. the display device includes a base layer, a circuit element layer, a display element layer, an encapsulation layer, a cover inorganic layer, a cover organic layer, an anti-reflection layer, and a filling part configured to overlap the first area. the electronic device is disposed below the base layer and configured to overlap the first area. a module hole is defined in the display module through which the circuit element layer, the display element layer, the encapsulation layer, the cover inorganic layer, and the cover organic layer overlapping the first area passes through to expose the base layer, and the filling part is disposed inside the module hole and is in contact with a portion of the base layer exposed by the module hole.
